Fuji Corporation

Hiromitsu Oka

Chikashi Teshima

Kenichi Hayashi

Tetsuo Hayashi

An electronic component mounter including a suction nozzle to pick up an electronic component housed in a housing section; a switching device configured to switch air supplied to a nozzle hole of the suction nozzle to negative pressure air when picking up the electronic component, and to switch the air supplied to the nozzle hole of the suction nozzle to positive pressure air when mounting the electronic component that was picked up by the suction nozzle on the circuit board; and a blow supply device configured to supply a first blow to the suction nozzle for a specified time when the positive pressure air is being supplied to the nozzle hole by a switching device. After the specified time has elapsed, stop the first blow and supply a second blow with a lower pressure than the first blow to the suction nozzle.

Growing community of inventors

Toyoake, Japan

Hiromitsu Oka