Dai Nippon Printing Co., Ltd.

Hiromitsu Ochiai

Toshihiko Takeda

Katsunari Obata

Atsushi Maki

Hiroyuki Nishimura

Hiroki Oka

Hiroshi Kawasaki

Takuya Higuchi

Yoshinori Hirobe

Koji Kobayashi

Yasuhiro Uchida

Akira Makita

Hirofumi Hideshima

Takayasu Komatsu

Takuya Ogio

Toshimu Watanabe

A deposition mask group includes a first deposition mask having two or more first through holes arranged along two different directions, a second deposition mask having two or more second through holes arranged along two different directions and a third deposition mask having two or more third through holes. The first through hole and the second through hole or the third through hole partly overlap when the first deposition mask, the second deposition mask and the third deposition mask are overlapped.

Deposition mask group, manufacturing method of electronic device, and electronic device

A deposition mask includes: a mask body having two or more first through-holes; and a support disposed on the mask body and having a second through-hole located at a position overlapped with the first through-holes in a plan view. The mask body has a first surface located on an opposite side of a side of the support, and a second surface located on the side of the support. An outermost circumference first through-hole, which is located on an outermost circumference in a plan view of the two or more first through-holes located at the position overlapped with the second through-hole in a plan view, includes a first point which is a center of the outermost circumference first through-hole in a plan view; the second through-hole includes a second point on an outline of the second through-hole, the second point being nearest to the first point.

Deposition mask

There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a method for producing a vapor deposition mask and a vapor deposition mask preparation body capable of simply producing the vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal maskin which a plurality of slitsare provided and a resin maskare stacked. Openingsrequired for composing a plurality of screens are provided in the resin mask. The openingscorrespond to a pattern to be produced by vapor deposition. Each of the slitsis provided at a position of overlapping with an entirety of at least one screen.

Vapor deposition mask, vapor deposition mask preparation body, method for producing vapor deposition mask, and method for producing organic semiconductor element

There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal maskin which a slitis provided and a resin maskin which openingscorresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slitare stacked, and the metal maskhas a general regionin which the slitis provided and a thick regionlarger in thickness than the general region.

A shadow mask is formed from a plate member comprising an outer frame portion, a body portion of a shadow mask having an outer peripheral line formed through an etching process and a plurality of connection portions through which the body portion of the shadow mask is supported by the outer frame portion. The shadow mask is formed from the plate member by removing the outer frame portion from the body portion of the shadow mask. In this process, a break portion is formed to the shadow mask by removing the outer frame portion so as to be recessed inward from the outer peripheral line of the shadow mask.

Shadow mask, plate member therefor and method of manufacturing shadow mask

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Tokyo, Japan

Hiromitsu Ochiai