Mitsubishi Electric Corporation

Hiromitsu Itamoto

Norio Okada

Tatsuo Hatta

Akihiro Matsusue

Takuro Shinada

Solder () joins together a second conductive pattern () of a flexible substrate () and a third conductive pattern () of a print substrate () and joins together a second GND pattern () of the flexible substrate () and a third GND pattern () of the print substrate (). A through hole () passes through the flexible substrate () and connects the first and second GND patterns () together. In an extension direction in which the second conductive pattern () extends, an end portion of a solder joint portion between the second conductive pattern () and the third conductive pattern () is in a position corresponding to the through hole () and is shifted from an end portion of the through hole ().

Substrate joining structure

A first conductive pattern () is provided on an upper surface of the submount (). A GND pattern () is provided on a lower surface of the submount (). A lower surface electrode () of a capacitor () is bonded to the first conductive pattern () with solder (). An upper surface electrode () of the capacitor () is connected to a light emitting device (). A terminating resistor () is connected to the first conductive pattern (). The first conductive pattern () has a protruding portion () which protrudes outside from the capacitor () in planar view. A width of the protruding portion () is narrower than a width of the capacitor ().

Optical semiconductor device

An optical modulator includes: laser diodes disposed in parallel with each other, each laser diode having a different lasing wavelength; optical waveguides disposed in parallel with each other with first ends facing the laser diodes; an optical isolator inserted between the laser diodes and the optical waveguides and attenuating return light reflected from the optical waveguides toward the laser diodes; a lens focusing light emitted from the laser diodes onto the optical waveguides through the optical isolator; an optical switch selecting one of the light beams exiting from the optical waveguides; and an optical modulator modulating the light beam selected by and output from the optical switch.

Optical module

An optical detecting device includes a light-detecting element for outputting an electrical signal, a pre-amplifier for amplifying the electrical signal, a signal line connected to an output of the pre-amplifier, and a resistor and a capacitor connected in series between the signal line and GND.

Light detecting device including a peaking circuit

An optical module includes a stem with a piercing hole, an optical element mounted on a top surface of the stem, a lead which passes through the piercing hole, one end of the lead being connected to the optical element, and an insulating material in the piercing hole and insulating the stem from the lead. An opening of the piercing hole on the top surface of the stem is smaller than an opening of the piercing hole on an underside of the stem.

Growing community of inventors

Tokyo, Japan

Hiromitsu Itamoto