Matsushita Electric Industrial Co., Ltd.

Hiromitsu Hamaguchi

Akio Misaka

Kenji Kawakita

Kenji Harafuji

A method of correcting design patterns in cells, having hierarchial structure and corresponding to exposure patterns, for proximity effects when exposing resist coated on a substrate to a charged-particle beam or to light. A first frame zone is provided having a predetermined width inside the boundary of each cell, and a second frame zone is provided having a predetermined width inside the first frame zone. Proximity effect correction operations are performed such that a pattern in the second frame zone and a pattern inside the second frame zone are used as a pattern to be corrected and a pattern in the first frame zone is used as a reference pattern when correcting pattern data in each cell for proximity effects and a pattern in the first frame zone in each cell is added to the pattern to be corrected and a pattern in the second frame zone in each cell is used as a reference pattern when correcting pattern data in a cell directly overlying each cell for proximity effect.

Method and apparatus for writing a pattern on a semiconductor sample

In formation of a fine pattern with direct electron beam delineation, disclosed is a method of obtaining parameters on an electron scattering intensity distribution expressed with a double Gaussian distribution obtained when exposing a resist with an electron beam. A resist on a substrate is exposed with an electron beam in accordance with an evaluation pattern which comprises a plurality of basic checked patterns each comprising longitudinal and lateral exposed stripes. The basic checked patterns are successively arranged longitudinally and laterally at predetermined intervals on a plane so as to form a plurality of longitudinal pattern rows and lateral pattern rows, widths of the stripes of the basic checked patterns in each of the lateral pattern rows being successively changed so as to be different from each other. The exposure doses for the basic checked patterns in each of the longitudinal pattern rows are successively changed so as to be different at every basic checked pattern, thereby obtaining, as a critical exposure dose, the minimum exposure dose in each of the longitudinal pattern rows on the basis of removed or remaining states of the non-exposed portions of the basic checked patterns to obtain the respective parameters.

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Osaka, Japan

Hiromitsu Hamaguchi