Fujitsu Ten Limited

Fujitsu Corporation

Shin-kobe Electric Machinery Co., Ltd.

Kel Corporation

Hiromichi Watanabe

Shinichi Sugiura

Yoshifumi Fukatsu

Hideaki Kaino

Motoaki Tani

Shinya Iijima

Yasuo Nishioka

Hiroaki Kobayashi

Toshiaki Sukeda

Teiji Majima

Naoki Sugita

Katsufumi Morimune

Yoshiaki Maruyama

Kenichi Kuroiwa

Takashi Yuda

Hiroyuki Yamanaka

Takafumi Yasuhara

Masatsugu Oohara

Toshihiro Kasai

Shuji Kimura

Naofumi Saito

Shigeru Mori

Toshio Sakata

Shinichi Kasahara

Eiji Nittoh

Nobuhiro Wada

A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over the surface of the semiconductor element, and is formed on a second bump formation face distanced from the back surface of the semiconductor element at a second distance being longer than the first distance, the second bump having a diameter larger than a diameter of the first bump.

Semiconductor device and method of manufacturing the same

In order to suppress the occurrence of damage on a press-fit joining wiring board, a peak value of stress generated on the board in the case of a press-fitting a press-fit terminal into a through-hole is reduced so that it can not exceed the design standard value of the board. In the press-fit terminal in which a body part, retaining part, introducing part and forward end part are integrally formed, a cross-sectional area of the introducing part is reduced to be smaller than that of the retaining part, so that an intensity of the elastic force of the introducing part is decreased to be lower than that of the elastic force of the retaining part. Alternatively, on the wiring board, elastic material is filled into resin for combining sheet-like base material of the board so as to relieve an intensity of stress generated on the board itself.

Electronic equipment provided with wiring board into which press-fit terminals are press-fitted

A connector fixing structure includes a substrate, a connector, and a housing. The substrate defines a first hole portion and a second hole portion. The connector includes a terminal of a pressfit shape that is inserted into the first holed portion to connect with the substrate electrically, and a housing having a leg portion of a press fit shape that is inserted into the second hole portion when the terminal is inserted into the first hole portion.

Connector fixing structure

An electronic control device enabling heat generated by a power module to be favorably radiated even in a high-temperature condition in an engine compartment. The unit includes a casing accommodating a control circuit substrate; a die-cast mounting plate forming a control circuit substrate support portion, a frame-like fitting member and an external mounting portion integrally together; and a metal substrate on which a power module is adhered. When the mounting plate is mounted on the wall of a transmission and the metal substrate is fitted in the opening in the bottom surface of the frame-like fitting member, a mounting surface in nearly the same plane is formed by the lower surface of the mounting plate and by the lower surface of the metal substrate permitting heat from the power module to be radiated to the wall.

Electronic control device

A pressfit terminal is to be inserted into a through hole defined in a substrate for electrically contacting with the through hole. The pressfit terminal includes a terminal main body and at least three protrusion portions. The at least three protrusion portions protrude outwardly from a surface of the terminal main body. At least part of the protrusion portions are arranged at intervals in a direction intersecting with an insertion direction of the terminal main body.

Pressfit terminal and connection structure

The present invention concerns a substrate for circuit wiring in which an electronic component is mounted, by soldering, to a wiring pattern formed on an insulated layer deposited over a metallic substrate. A silica-based filler and a rubber-based filler are added in the insulated layer to reduce the linear thermal expansion of the layer and increase its elastic modulus. The mounting portion of an electronic component is molded with a resin material to which a silica-based filler has been added, and which thus has a coefficient of linear thermal expansion smaller than the coefficient of linear thermal expansion of the insulated layer. This serves to alleviate the stress caused by the linear thermal expansion of the metallic substrate, and thereby to prevent separation from occurring between the insulated layer and the metallic substrate, as well as between the insulated layer and the wiring pattern, when subjected to a high-temperature environment.

Substrate for circuit wiring

A substrate includes multiple layers mounted with a mounted part at its surface. A part pad is provided to the substrate to correspond to an electrode of the mounted part . A circuit pattern is provided at a layer at an inner portion of the substrate and an electrically conductive portion for electrically connecting the part pad and the circuit pattern right under the part pad

Substrate structure

A method for establishing electrical connection of a pressure-connector terminal by forming a plurality of divided terminals by providing a plurality of grooves on a connecting surface of a pressure-connector terminal used for TAB connection and COG connection, placing such divided connecting surfaces in contact with a connecting surface of an opposed terminal electrode, imperfectly hardening a bonding material under such condition, deforming a divided terminal by applying pressure and thereafter perfectly hardening the bonding material and a configuration of the pressure-connector terminal are disclosed.

Method of connecting a pressure-connector terminal of a device with a

A method is disclosed of forming a fine pattern on a substrate, in which an etching mask pattern is formed on a layer of material of a pattern to be formed, an overlying layer is deposited on the pattern material layer and the mask pattern, and thereafter, the overlying layer and the pattern material layer are etched by ion etching. This method makes it possible, due to the pattern-widening effect caused by the deposition of the overlying layer and by the use of ion etching, to form a pattern having a gap smaller than 0.5 .mu.m or a contiguous-disk pattern having a period of 2 .mu.m or less by photolithography having a 1 .mu.m resolution. It is also possible to form a pattern adapted to enable an easy planing process, by utilizing a difference in etching rates between the mask pattern and the overlying layer. An apparatus used for carrying out the pattern forming method comprises film layer forming means and ion etching means, whereby the overlying layer forming step and the ion etching step can be successively performed by using one and the same apparatus.

Method for forming patterns

Growing community of inventors

Kobe, Japan

Hiromichi Watanabe