Renesas Technology Corp.

Hitachi, Ltd.

Kabushiki Kaisha Toshiba

Hitachi Ulsi Systems Co., Ltd.

Other

Dai Nippon Printing Co., Ltd.

Renesas Electronics Corporation

Hitachi Vlsi Engineering Corp.

Hitachi Microcomputer System, Ltd.

Sanyo Electric Co., Ltd.

Hitachi Medical Corporation

Kyowa Hakko Kogyo Co., Ltd.

Fujitsu Toshiba Mobile Communications Limited

Fujitsu Mobile Communications Limited

Renesas Eastern Japan Semiconductor, Inc.

Hiromichi Suzuki

Fujio Ito

Yoshinori Miyaki

Kazunari Suzuki

Akihiko Kameoka

Kunihiro Tsubosaki

Kunihiko Nishi

Takafumi Nishita

Masachika Masuda

Gen Murakami

Takashi Amano

Wahei Kitamura

Isao Ohba

Takahiro Naito

Takayuki Okinaga

Takashi Emata

Norimichi Chiba

Tsuyoshi Kaneda

Susumu Baba

Osamu Horiuchi

Tokuji Toida

Hiroaki Tanaka

Sueo Kawai

Satoshi Mizoguchi

Junpei Kusukawa

Takafumi Konno

Noriaki Sakamoto

Shigeki Tanaka

Makoto Kitano

Yoshihisa Matsubara

Akihiro Yaguchi

Toshio Sasaki

Satoshi Nakamura

Naotaka Tanaka

Yoshitaka Takezawa

Tatsuya Nagata

Kanji Otsuka

Seiji Kato

Hajime Hasebe

Tetsuo Kumazawa

Tatsuo Hiramatsu

Susumu Okikawa

Yoshikazu Tomida

Hironori Mitoh

Yuuji Shirai

Masahiro Sata

Masahiro Seto

Tadashi Etoh

Ryuuji Yoshihara

Kosho Akiyama

Masayoshi Tsugane

Yujiro Kajihara

Kazunori Katoh

Koichi Sato

Hajime Sato

Tadashi Yoshida

Koji Tomita

Yuji Nakajima

Yuji Yamaguchi

Toshiaki Ishii

Akira Saito

Yoshihiko Shimanuki

Hideharu Anazawa

Masao Teshima

Takashi Minemura

Ryozo Takeuchi

Hiroyuki Hotta

Ryosuke Saito

Hiroshi Shimasaki

Masataka Tokoro

Hiroshi Ohsawa

Seiji Sugimoto

Hisao Iwasaki

Tomoo Matsuzawa

Seiji Hashimoto

Seiji Suzuki

Kenji Matsuzaki

Tatsuo Suda

Fumio Murakami

Kazuyuki Miyano

Takuji Ide

Hiroshi Mikino

Atsushi Kurahashi

Daiji Sakamoto

Takao Saruta

Yuzuru Ishimura

Shu Wakino

Toru Ishida

Hiroyuki Takeno

Hiroshi Shimoji

Keiko Kurakawa

Masaru Yamada

Toshiaki Monkawa

Matsuhiko Hayashi

Toshimasa Shinki

Hirotaka Otake

Hiroko Shimada

Syuhei Isogaya

Naruto Nishimura

According to one embodiment, a circuit board attachment structure comprise a housing to which the circuit board is attached, a mount provided on the housing and provided outside a portion of the housing where the circuit board is attached, a holding piece extending from the mount to and on the circuit board and sandwiching the circuit board with the housing, and a conductive gasket contacting the circuit board. The gasket is provided at least in a region where the circuit board is sandwiched between the holding piece and the housing, and the gasket is pressed between the holding piece and the housing, and the circuit board and the housing is electrically connected to each other via the pressed gasket.

Circuit board attachment structure and electronic device adopting the same

A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.

Resin-sealed semiconductor device and associated wiring and support structure

According to one embodiment, a stand for an electronic device, includes a first housing and a connector. The connector is configured to detachably connect to the electronic device and to be rotatably supported by the first housing. The electronic device includes a display face and a second housing. The second housing includes a first opening formed at an end thereof. The connector includes a support, a protrusion, and a base member. The support is configured to support the second housing from outside. The protrusion is spaced from the support and inserted into the first opening. The base member includes a first part configuring at least a portion of the support and a second part integrated with the first part and configuring at least a portion of the protrusion.

Stand for electronic device and electronic device

A biological optical measurement instrument includes a single temperature sensor that detects a radiation temperature from a plurality of light emitting elements that emit light of a predetermined wavelength, and an absorption coefficient correcting unit that corrects an absorption coefficient value of a notable substance inside the object on the basis of the radiation temperature detected by the temperature sensor, referring to data indicating a correspondence relationship between a temperature obtained in advance for each emitted light of the plurality of light emitting elements and an absorption coefficient value that varies according to the temperature.

Biological optical measurement instrument and operation method therefor

A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.

Semiconductor device and manufacturing method therefor

According to one embodiment, an electronic apparatus includes a first housing, a first display and a transparent first panel. The first display in the first housing includes a first display portion. The first panel covers the first display portion and includes a first flat surface portion and a first curved surface portion along an outer edge of the first flat surface portion. The first display portion displays images in a location corresponding to the first flat surface portion and a location corresponding to the first curved surface portion respectively at different aspect ratios from each other.

Electronic apparatus

Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device

A mobile terminal includes a first antenna configured to receive power from the first circuit board housed in the first housing, a second antenna configured to receive power from the second circuit board housed in the second housing, a first signal cable configured to electrically connect the first circuit board to the second circuit board and transmit a signal between the first circuit board and the second circuit board, and a second signal cable configured to electrically connect the first circuit board to the second circuit board and bypasses a board current flowing through the first signal cable from the first circuit board to the second antenna during operation of the second antenna.

Mobile terminal

A semiconductor composite wiring assembly includes a wiring assembly and a lead frame. A copper wiring layer of the wiring assembly includes first terminals, second terminals, and wiring sections connecting the terminals. The second terminals and the lead frame are electrically connected by connecting members. The lead frame includes a die pad for mounting the wiring assembly, and lead sections located at outer positions. The die pad includes a central area in which a semiconductor chip is mounted via the wiring assembly, and a peripheral area connected to the central area with spaces formed therebetween that serve as resin-seal inflow spaces. The wiring assembly is positioned over the central area and the peripheral area so as to cover the central area completely and the peripheral area partially, and at least the central area and the peripheral area of the die pad are glued to the wiring assembly by resin paste.

Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device

In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chipand a resin is enlarged by making the external size of a die padsmaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chipshaving different external sizes can be mounted on the die padby cutting the leading ends of leadsto a suitable length in accordance with the external sizes of the semiconductor chips

Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two

According to an aspect of the invention, a portable terminal includes: a first audio input-output unit and a second audio input-output unit configured to receive audio when a mode is set as an input mode and output audio when the mode is set as an output mode; and a setting unit configured to set the respective modes of the first audio input-output unit and the second audio input-output unit.

Portable terminal

A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device electrically connects an electrode provided on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The metal substrate is provided on one side of the insulating layer. The copper wiring layer is provided on another side of the insulating layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode provided on the semiconductor chip. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.

A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively. the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.

Method of manufacturing a semiconductor device including plural semiconductor chips

Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300&#xb0; C. (preferably 180 to 300&#xb0; C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented.

Manufacturing method of semiconductor device and manufacturing method of lead frame

Making a report with an authenticated image includes certifying an imaging time of an image captured by a portable terminal with a camera with an objective time to authenticate image information. A report making program for making a work report is downloaded in the portable terminal by a Web browser from a web server. Report data such as an image and information inputted according to the report making program is sent from the portable terminal to the web server. The web server transfers the report data to a document management program. The document management program automatically sorts the report data according to an information category of the report data and stores the report data. The imaging time of the image information included in the report data or the image information contained in the report made based on the report data is authenticated with a reference time of the web server.

System for making report with authenticated image

Growing community of inventors

Tokyo, Japan

Hiromichi Suzuki