Ando Electric Company

Hiromichi Koide

Shinya Suzuki

Tatsuaki Suzuki

Ichiro Tano

A cooling system can cool electronic devices with assurance following the heights of the electronic devices mounted on a printed board. The cooling system is thin and light in weight and can easily inspect and maintain the electronic devices. A cooling pipe is disposed in a U-shape about a plurality of electronic devices mounted on the printed board. The cooling pipe is jointed with the cooling plate by caulking from the opposite side of the printed board. A thermal conduction plate is engaged with the cooling plate from the upper portion thereof and the thermal conduction members each having the notched portion are inserted into the insertion holes of the thermal conduction plate. The thermal conduction members can be slid up and down and turned to the right and left in the insertion holes and they are pressed and biased against the electronic devices by a leaf spring provided on the thermal conduction plate. Each electronic device can be inspected by inserting a probe or the like through the notched portion.

Cooling system of a printed board

The present application discloses a printed circuit board and a cooling system for a printed circuit board which comprise a unitary cooling line which is arranged on an upper face of the printed circuit board and a bottom face of the printed circuit board and winds back and forth in a plan which is parallel to the printed circuit board in order for coolant to flow along the upper and bottom faces of the printed circuit board, heat conducting members which make contact with a component which is mounted on the printed circuit board and are detachably connected to the first heat conducting member and are detachably connected with the cooling line by a connecting mechanism.

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Tokyo, Japan

Hiromichi Koide