Murata Manufacturing Co., Ltd.

Murata Mfg. Co., Ltd.

Hiromichi Kawakami

Hiroji Tani

Shizuharu Watanabe

Makoto Tose

Toshiki Tanaka

Hiroshi Takagi

Hirofumi Sunahara

Kazuo Kishida

Yuki Takemori

Takahiro Oka

Yoshitake Yamagami

Yoshifumi Saitoh

Mitsuyoshi Nishide

Michiaki Iha

Isao Kato

Tomoya Yokoyama

Tsuyoshi Katsube

Akira Baba

Yoshifumi Saito

Tadaji Takemura

Hideyuki Harada

Masaaki Hanao

Yuzo Kawada

A multilayer circuit boardincludes a core substrate; a resin section, which covers the side surface and a lower surfaceof the core substrate; and a plurality of metal pins, which are disposed within the resin section. The core substrateincludes a ceramic multilayer section, which is disposed on the mother-substrate side of the core substrate; and a resin multilayer section, which is stacked on a main surfaceon a side of the ceramic multilayer section, the side being opposite to the mother substrate. The resin sectionincludes the plurality of metal pins, and a through-hole, which extends through the resin sectionin its thickness direction. A fastening partpenetrates the through-hole, to mount the multilayer circuit boardon the mother substrate.

Multilayer circuit board used for probe card and probe card including multilayer circuit board

A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1&#x3e;X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Multilayer ceramic substrate

A composite substrate that is composed of a resin layer including an interlayer connection metal conductor and multiple ceramic layers that each include interlayer connection metal conductor, such that the resin layer is interposed between the ceramic layers, and the interlayer connection metal conductor in the resin layer is integrated with the interlayer connection metal conductors in the ceramic layers.

Composite substrate and method for manufacturing composite substrate

A low temperature co-fired ceramic material includes a SiO&#x2014;BaO&#x2014;AlO-based primary component, and, as secondary components, 0.044 to 0.077 parts by weight of iron in terms of FeOand 0.30 to 0.55 parts by weight of zirconium in terms of ZrOrelative to 100 parts by weight of the SiO&#x2014;BaO&#x2014;AlO-based primary component. The SiO&#x2014;BaO&#x2014;AlO-based primary component preferably includes 47% to 60% by weight of SiO, 20% to 42% by weight of BaO, and 5% to 30% by weight of AlO.

Low temperature co-fired ceramic material, low temperature co-fired ceramic body, and multilayer ceramic substrate

A method of producing a ceramic multilayer substrate involves producing a green composite laminatecontaining first and second shrink-suppressing layers formed on the main surfaces of a green multilayer mother substratehaving a plurality of ceramic green layerscontaining ceramic powder, the shrink-suppressing layers containing a sintering-difficult powder substantially incapable of being sintered under the sintering conditions for the ceramic powder; forming first groovesextending from the first shrink-suppressing layerside into a part of the multilayer mother substrate; firing the composite laminate; removing the first and second shrink-suppressing layersandand taking out the sintered multilayer mother substrate; and dividing the multilayer mother substratealong the grooves, and obtaining a plurality of the ceramic multilayer substrates. Thereby, shrinkage in the plan direction at firing can be suppressed. Thus, a ceramic multilayer substrate having a high dimensional accuracy and a high reliability can be produced with a high production efficiency.

Method of producing ceramic multilayer substrates, and green composite laminate

A method of producing a ceramic multilayer substrate involves: producing a green composite laminatecontaining first and second shrink-suppressing layers formed on the main surfaces of a green multilayer mother substratecontaining ceramic powder, the first and second shrink-suppressing layers containing a sintering-difficult powder substantially incapable of being sintered under the sintering conditions for the ceramic powder; forming first groovesextending from the first shrink-suppressing layerside into a part of the multilayer mother substrate; firing the composite laminate; removing the first and second shrink-suppressing layersand; dividing the multilayer mother substratealong the groovesand obtaining a plurality of the ceramic multilayer substrates. Thereby, shrinkage in the plan direction at firing can be suppressed. Thus, a ceramic multilayer substrate having a high dimensional accuracy and a high reliability can be produced with a high production efficiency.

Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body

To produce a green composite laminate, a green multilayer collective substratecontaining low-temperature sinterable glass ceramic powder as a main ingredient is disposed between first and second shrinkage-restraining layersandcontaining alumina powder as a main ingredient. Groovesare formed on one main surfaceof the green composite laminatesuch as to pass through the first shrinkage-restraining layerand the green multilayer collective substrateand reach the second shrinkage-restraining layer, but not to reach the other main surfaceof the green composite laminate. The green composite laminateprovided with the groovesis sintered under conditions where the low-temperature sinterable glass ceramic powder is sintered and the green first and second shrinkage-restraining layersandare removed to prepare a plurality of ceramic multilayer substrates. This manufacturing method offers ceramic multilayer substrates with a high dimensional accuracy and substantially prevents defective divisions when a multilayer collective substrate is split into a plurality of ceramic multilayer substrates.

Ceramic multilayer substrate manufacturing method and unfired composite multilayer body

A method for manufacturing multilayer ceramic substrates in accordance with a multiple formation method using a non-shrinkage process allows the multilayer ceramic substrates to be smoothly formed by dividing a sintered multilayer mother substrate, and in addition, external terminal electrodes in a preferable state can be efficiently formed. When a green composite laminate comprising shrinkage suppression layers and a green multilayer mother substrate provided therebetween is formed, through-holes are provided on dividing lines so as to divide conductors, and in addition, cut-in grooves are provided along the dividing lines. After the shrinkage suppression layers are removed from the fired composite laminate, the multilayer ceramic substrates are obtained by dividing the multilayer mother substrate along the through-holes and the cut-in grooves. Conductors, which are formed into the external terminal electrodes, are exposed on parts of side surfaces of the multilayer ceramic substrate corresponding to parts of the inside surfaces of the through-holes.

Method for manufacturing multilayer ceramic substrates

A photosensitive insulating paste contains a borosilicate glass powder and a crystalline SiO powder, wherein the powders are dispersed in a photosensitive organic vehicle and the paste contains the crystalline SiO component in an amount of about 3-40 wt. % after sintering. A thick-film multi-layer circuit substrate (e.g., chip inductor) comprising an insulating substrate on which insulating layers are formed, wherein the insulating layers are formed through exposure, development and sintering, after the application of the photosensitive insulating paste.

Photosensitive insulating paste and thick film multi-layer circuit substrate

A multilayered board includes a laminate including a plurality of glass-containing insulating layers, each glass-containing insulating layer being provided with an electrode on the surface thereof. The glass-containing insulating layer is formed by firing a layer containing 60% by volume or less of a glass component before firing, a portion of the glass component is segregated in the surface region of the glass-containing insulating layer by firing, and the electrode is bonded to the surface of the glass-containing insulating layer by means of the segregated glass component. A method for fabricating a multilayered board is also disclosed.

Multilayered board and method for fabricating the same

A crystallized glass composition contains a principal ingredient comprising SiO , MgO and Al O and contains about 2 to 20 parts by weight of B O relative to 100 parts by weight of the principal ingredient. In a ternary diagram, the weight ratio (SiO , MgO, Al O ) lies within a region surrounded by point A (44.0, 55.0, 1.0), point B (34.5, 64.5, 1.0), point C (35.0, 30.0, 35.0) and point D (44.5, 30.0, 25.5).

Crystallized glass composition, sintered crystallized glass compact, and circuit substrate using the same

An insulator composition which can be sintered at a relatively low temperature and which exhibits a low dielectric constant and a thermal expansion coefficient suitable for forming an insulator layer of a laminated electronic part contains a crystallized glass composition containing SiO , MgO and CaO as main components, and Al O , an amorphous silicate glass composition, and a ceramic composition. The composition ratio by weight % (SiO , MgO, CaO) of the main components of the crystallized glass composition lies in a region surrounded by point A (30, 25, 45), point B (30, 5, 65), point C (45, 5, 50) and point D (45, 25, 30) shown in a ternary composition diagram thereof. The thermal expansion coefficient of the insulator composition after sintering can easily be changed by changing the content ratio of the crystallized glass composition, the amorphous silicate glass composition and the ceramic composition.

Insulator composition, insulator paste and laminated electronic part

A composite monolithic electronic component has a laminate including a base layer having a relative dielectric coefficient of about 10 or less and a functional layer which is at least one of a high-dielectric-coefficient layer having a relative dielectric coefficient of about 15 or more and a magnetic layer. The base layer contains a crystallized glass containing SiO , MgO, Al O and B O , and a ceramic oxide having a thermal expansion coefficient of about 6.0 ppm/&deg;C. or more. The functional layer contains an amorphous glass having a softening point of about 800&deg; C. or less.

Growing community of inventors

Moriyama, Japan

Hiromichi Kawakami