Screen Holdings Co., Ltd.

Hiromichi Kaba

Takuya Sato

Akihiko Taki

Yuichi Takayama

Toshihito Morioka

Kazuhiko Nakazawa

Toru Edo

Tomomi Iwata

Kunio Yamada

Noriyuki Kikumoto

Nobuyuki Shibayama

Disclosed is a substrate treating apparatus for treating a substrate with a treating liquid, the apparatus including the following: a rotating member including a plurality of through-holes formed therein; a plurality of support pins attached to the through-holes with a non-sealing structure, and configured to support a substrate in such a manner that the substrate is spaced apart; a supply nozzle configured to supply a treating liquid to the substrate; a cover spaced apart below the rotating member; a rotational drive device configured to drive the rotating member rotationally in a horizontal plane; and a drive device configured to drive the support pins.

Substrate treating apparatus

A substrate treating apparatus includes a carrier platform, a transport mechanism, and a controller. The carrier platform places a carrier thereon. The carrier includes a plurality of shelves arranged in an up-down direction. The shelves are each configured to place one substrate thereon in a horizontal posture. The transport mechanism is configured to transport a substrate to a carrier placed on the carrier platform. The controller controls the transport mechanism. The transport mechanism includes a hand and a hand driving unit. The hand supports a substrate. The hand driving unit moves the hand. The controller changes a height position of the hand when the hand is inserted between two of the shelves adjacent to each other in the up-down direction, depending on a shape of a substrate taken from or placed on one of the shelves by the transport mechanism.

Disclosed are a substrate treating apparatus and a substrate transporting method. The substrate treating apparatus includes a first transport mechanism. The first transport mechanism includes a hand. A hand includes a base, a suction portion, a first receiver, a second receiver, and a receiver driving unit. The suction portion is attached to the base. The suction portion flows gas along a top face of a substrate, and sucks the substrate upward without contacting the substrate. The first receiver and the second receiver are supported on the base. The first receiver and the second receiver are disposed below the substrate sucked by the suction portion. The first receiver and the second receiver can receive a back face of the substrate. The receiver driving unit moves the second receiver with respect to the base. The receiver driving unit causes the second receiver to access the first receiver and to move away from the first receiver.

Substrate treating apparatus and substrate transporting method

A substrate processing method is provided, which includes: a substrate holding step of causing a substrate holding unit to hold a substrate; an ozone-containing hydrofluoric acid solution supplying step of supplying an ozone-containing hydrofluoric acid solution containing ozone dissolved therein a hydrofluoric acid solution to one major surface of the substrate held by the substrate holding unit; a brush-cleaning step of cleaning the one major surface of the substrate by bringing a cleaning brush into contact with the one major surface of the substrate after the ozone-containing hydrofluoric acid solution supplying step; and an ozone water supplying step of supplying ozone water to the one major surface of the substrate before start of the brush-cleaning step after the ozone-containing hydrofluoric acid solution supplying step or in the brush-cleaning step.

Substrate processing method and substrate processing device

A substrate processing apparatus includes a driving magnet that is disposed correspondingly to a movable pin and that has a predetermined polar direction with respect to a radial direction of a rotary table, a pressing magnet that has a magnetic pole that gives an attractive magnetic force or a repulsive magnetic force between the driving magnet and the pressing magnet and that presses a support portion against a peripheral edge of a substrate by urging the support portion toward a contact position by means of the attractive magnetic force or the repulsive magnetic force, and a pressing-force changing unit that changes a magnitude of a pressing force against the peripheral edge of the substrate pressed by the support portion while keeping the magnitude higher than zero in response to rotation of the rotary table.

Substrate processing apparatus

A substrate holding/rotating device includes an urging unit, urging support portions of movable pins to either an open position or a hold position, first and second driving magnets, mounted in correspondence to respective movable pins of respective first and second movable pin groups and having mutually opposite magnetic pole directions, a first moving magnet, for urging the support portions of the first movable pin group to the other of either the open position or the hold position, and a second moving magnet, for urging the support portions of the second movable pin group to the other of either the open position or the hold position.

Substrate holding/rotating device, substrate processing apparatus including the same, and substrate processing method

This substrate holding/rotating device includes an opening magnet forming a predetermined magnetic field generation region through which each movable pin rotating in response to rotation of the rotary table is capable of passing, the magnetic field generation region disposed so as to be eccentric with respect to a rotation direction of the rotary table and so as to allow only driving magnets corresponding to part of the plurality of movable pins to pass through the magnetic field generation region, the opening magnet giving a repulsive force or an attractive force to the driving magnet of the movable pin passing through the magnetic field generation region, the opening magnet generating a force that enables the support portion of the movable pin urged to the hold position by the urging unit to move toward the open position against an urging force of the urging unit.

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Kyoto, Japan

Hiromichi Kaba