Hitachi, Ltd.

Hitachi Car Engineering Co., Ltd.

Hitachi Automotive Engineering Co., Ltd.

Other

Hiromichi Ebine

Satoshi Shimada

Masahide Hayashi

Katsuhiko Kikuchi

Masahiro Matsumoto

Masayuki Miki

Seiko Suzuki

Shigeki Tsuchitani

Akira Koide

Norio Ichikawa

Kazuo Sato

Sadayasu Ueno

Atsushi Miyazaki

Masayoshi Suzuki

Kanemasa Sato

Susumu Murakami

Tomoyuki Tanaka

Masanori Kubota

Yasuhiro Asano

Masahiro Kurita

Yukiko Sugisawa

Benjamin Kloeck

Yukiko Kawai

An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.

Electronic device and pressure sensor

An outer case connector portion, a gauge housing case, and the like for use with a pressure sensor, for example, are generally made of a thermoplastic or thermosetting resin. However, the resin physically causes curing shrinkage. Especially when a metal is insert molded with a resin, curing shrinkage of the resin generates a gap at the interface between the resin and the metal. By filling an anaerobic, high-permeability adhesive in the gap, hermetic sealing can be ensured and reliability can be enhanced. Inexpensive hermetic sealing and enhanced reliability are realized.

Pressure sensor, flowmeter electronic component, and method for manufacturing the same

The present invention provides a pressure detector capable of easily responding to changes in specification. The pressure detector has a sensor unit for detecting pressure and electronic parts for reducing electrical disturbance which are electrically joined to an exposed part of lead material of an opening of an external case. Thermoset resin is injected and set in the opening to obtain fixed members. An external electronic part for compensating for transient voltage resistance and electromagnetic failure resistance of a single one-chip semiconductor sensor can be mounted, and cost can be reduced by miniaturization, light weight, and reduction in man-hours required for assembly.

Pressure detecting apparatus

A semiconductor acceleration sensor is formed by a cantilever having a conductive movable electrode of predetermined mass at one end, at least one pair of fixed conductive electrodes which are stationary with respect to the movable electrode located on opposing sides of the movable electrode, and gaps provided between the movable electrode and the fixed electrodes. To prevent the movable electrode becoming fused to the contacted fixed electrode, in a first aspect of this invention, an insulating layer is provided between the movable electrode and fixed electrodes, the layer being either on the movable electrode or on the fixed electrodes and in a second aspect the movable electrode or, preferably, the fixed electrodes, are formed of a high melting point material. In such a second aspect, to improve adhesion between the high melting point material and a substrate to which the fixed electrodes are mounted, a lower melting point material is firstly coated on the substrates. A sensor detector unit processing circuit has the output characteristic of the circuit digitally adjusted by suitable switching of a plurality of resistors, and the sensor chip and the detector unit integrated circuit may be located on a common base and mounted in a hermetically sealed chamber to prevent adverse environmental effects affecting operation of the sensor and detector unit assembly. A gas having a dew point of -40.degree. C. or lower is, advantageously, charged into the hermetically sealed chamber.

Semiconductor acceleration sensor and vehicle control system using the

An electrostatic type micro accelerometer comprising means for preventing permanent sticking between a movable electrode and a stationary electrode due to residual dielectric polarization, resisual electric charges and water adsorption and condensation around possible contacting portions therebetween when the movable electrode excessively displaces. The sticking preventing means is realized by disposing one of electric field reducing means, water adsorption and condensation reducing means and contacting area limiting means around the possible contacting portions.

Electrostatic type micro transducer and control system using the same

A capacitive type semiconductor accelerometer has an intermediate silicon plate of n type conductivity including a movable electrode constituting a pendulum mass formed within the intermediate silicon plate and supported thereby via a beam so as to permit movement in a direction perpendicular to its plane. A first conductive island is formed within the intermediate plate and is immovably supported thereby via a first insulating leg so as to be isolated therefrom, and an upper glass plate is anodic bonded to the intermediate silicon plate. A first stationary electrode is formed on the upper glass plate at the position facing one face of the movable electrode with a predetermined gap. A lower glass plate is anodic bonded to the intermediate silicon plate and a second stationary electrode is formed on the lower glass plate at the position facing the other face of the movable electrode with a predetermined gap. First, second and third pads are disposed in common on the lower glass plate at the outside of the intermediate silicon plate, the first pad being electrically connected to the first stationary electrode via a first thin film lead formed on the lower glass plate and the first conductive island, the second pad being electrically connected to the movable electrode via a second thin film lead formed on the lower glass plate and the intermediate silicon plate and the third pad being electrically connected to the second stationary electrode via a third thin film lead formed on the lower glass plate.

Capacitive type semiconductor accelerometer

Growing community of inventors

Hitachinaka, Japan

Hiromichi Ebine