Hitachi, Ltd.

Hitachi Car Engineering Co., Ltd.

Other

Hiromichi Anan

Keiichi Mashino

Yoshitaka Ochiai

Toshiyuki Innami

Shinichi Fujino

Akira Mishima

Shinji Shirakawa

Atsuhiro Yoshizaki

Osamu Suzuki

Osamu Koizumi

Toshiaki Ueda

Kenji Takahashi

Takashi Yasuhara

Hideaki Mori

Masayuki Yamada

Sumio Sudo

Yasuhiko Kimura

Hidemitsu Kobayashi

Syuichi Hara

Suetarou Shibukawa

Takefumi Oowada

Hisashi Kondo

One method of achieving the above subjects is by connecting a block member, which is connected to the side opposite to that of a semiconductor chiphaving insulating substratesandconnected to the top and bottom of the semiconductor chip, to a block memberacross an laminated structure constituted by the semiconductor chipand the insulating substratesand

Semiconductor module and power conversion device

The present invention provides a semiconductor device which reduces an inductance of wiring for bridge-connecting semiconductor switches and realizes a reduction in size. Within the semiconductor device formed are two controllable bridge-connected semiconductor switchesand, an output terminal, positive/negative polarity DC terminalsand, and an insulating substratein which conductor layersandhaving a conductor section and in an inner layer for bridge-connecting the semiconductor switches to the DC terminals on a surface thereof and insulating layersandare alternately laminated. The surface and inner-layer conductor layersandwhich interpose the insulating layertherebetween are electrically connected by a conductorpassing through the insulating layerinterposed between the conductor layersand. A current path (dotted line) is so provided as to allow current flowing through a bridge circuit for mounting the two semiconductor switches on the insulating substrate to flow in opposite directions between the conductor layersandwhich interpose the insulating layertherebetween.

Semiconductor device having bridge-connected wiring structure

One method of achieving the above subjects is by connecting one of electroconductive members, which are pre-connected to the top and bottom of a semiconductor chipand have thermal conductivity, to an electroconductive member, which is used with the semiconductor chipto constitute a laminated structure, in electrically insulated form on the same surface as the installation surface of the electroconductive memberso as to straddle the laminated structure constituted by the semiconductor chipand the electroconductive member

A positive side conductor and a negative side conductor of an input terminal electrically connected to semiconductor elements, are electrically insulated from each other, and are laminated with each other, and the input terminal having such a laminated structure, an output terminal and substrates mounted thereon the semiconductor elements are arranged in a checkered pattern in a container. Further, the semiconductor elements mounted on the substrates, the input terminal and the output terminal are electrically connected to one another so as to obtain a loop-like electric path on a conductive member, thereby it is possible to aim at miniaturizing the power conversion apparatus and lowering the inductance thereof.

Power conversion apparatus and mobile object incorporating thereof

In an electric power conversion/inversion apparatus, including, such as an inverter therein, for obtaining reduction in circuit inductance and wiring resistance therein by bringing small as a whole, having good installability and high reliability and efficiency of electric power conversion, as well, semiconductor chips are disposed, being put between a positive input bus bar and a negative input bus bar and plural output bus bars at crossing positions thereof, and are connected electrically and thermally, to the positive input bus bar in a pole direction consistent therewith while to the negative input bus bar in a pole direction consistent therewith, and further to the common output bus bars in pole directions being different from side by side.

Electric power conversion/inversion apparatus

A linear shape straight angle line is transformed to form U-shape configuration in advance and by sandwiching a stator tooth portion to adjacent slots linear shape two sides are inserted and using a thin plate rod shape chip between both ends of U-shape side of the above stated coil is connected and then the coil is formed to have one winding close circuit. The plural coils are inserted and as stated in above between the both ends of an anti-U-shape side is connected, and a stator coil for forming a predetermined winding turn number is obtained. When an end face of the anti-U-shape side and the thin plate shape chip are overlapped and connected, a plate thickness of a portion in which they are overlapped is reduced by half respectively, and when they are overlapped, it becomes the plate thickness which corresponds to a plate thickness of the above stated straight angle line coil. A length of a coil end portion can be shortened widely.

Stator of rotating electric machine

A movable blade pump including an actuating mechanism for imparting rotational movement to blades which mechanism is contained in an impeller boss sealed against the outside and filled with hydraulic fluid and is driven by a hydraulic cylinder device secured to a suction casing below the impeller boss. Feed and discharge of hydraulic fluid into and from the hydraulic piston device are effected through fluid passages formed in the suction casing and a fixed mounting for the hydraulic fluid device, and the blades are set at any angular positions within the range of the stroke of the piston.

Movable blade pump

Growing community of inventors

Nishiibaraki, Japan

Hiromichi Anan