Sumitomo Bakelite Company Limited

Hiromi Oki

Kazuyoshi Fujita

Atsushi Izumi

Yukiharu Ono

Takashi Enoki

Takahiro Harada

Sumiya Miyake

Yoshiyuki Go

Yoshihito Akiyama

Yumiko Yamanoi

Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.

Resin composition, varnish, resin film and semiconductor device

A resin composition is provided comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), Ris a single bond or has a structure represented by formula (2); Rto Rare respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and 'X' is any of &#x2014;O&#x2014;, &#x2014;NHCO&#x2014;, &#x2014;CONH&#x2014;, &#x2014;COO&#x2014; and &#x2014;OCO&#x2014;; further, wherein in formula (2), 'Ar' is an aromatic group; &#x201c;Y&#x201d; is any of a single bond, &#x2014;O&#x2014;, &#x2014;S&#x2014;, &#x2014;OCO&#x2014; and &#x2014;COO&#x2014;; &#x201c;q&#x201d; is an integer of 1 or more; Ris hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when &#x201c;q&#x201d; is an integer of 2 or more; at least one of Rto Ris the group having an alicyclic structure when Ris a single bond; at least one of Rto Ris the group having an alicyclic structure when Rhas the structure represented by formula (2); and &#x201c;*&#x201d; and &#x201c;**&#x201d; represent a position to be bonded to a different chemical structure.

Resin composition, varnish, resin film and semiconductor device using the same

The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That is, the present invention is an epoxy resin composition comprising a compound (A) having two or more epoxy groups in the molecule, a co-condensation product (B) having two or more phenolic hydroxyl groups in the molecule, and a molecular association product (C) of a tetra-substituted phosphonium (X), a compound (Y) having two or more phenolic hydroxyl groups in the molecule, and a conjugate base of the compound (Y) having two or more phenolic hydroxyl groups in the molecule, said conjugate base being a phenoxide type compound obtained by removing a hydrogen atom from the aforesaid compound (Y) having two or more phenolic hydroxyl groups in the molecule.

Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product

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Tokyo, Japan

Hiromi Oki