Nippon Kayaku Kabushiki Kaisha

Daiichi Pharmaceutical Co., Ltd.

Hiromi Morita

Shigeru Moteki

Hiroshi Kikuchi

Makoto Uchida

Hiroaki Ohno

Yasumasa Akatsuka

Sadao Hirota

Ryutaro Tanaka

Kiyoto Yachi

Susumu Nagao

Kazuyuki Murata

Ichiro Kimura

The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): (wherein, Rrepresents a tetravalent aromatic tetracarboxylic acid residue selected from the group consisting of pyromellitic acid, 3,4,3',4&#x2032;-diphenyl ether tetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid and 3,4,3&#x2032;,4&#x2032;-benzophenone tetracarboxylic acid, Rrepresents at least one kind of divalent diamine residue selected from the group consisting of diamino-4,4&#x2032;-hydroxydiphenylsulfone, 4,4&#x2032;-diamino-3,3&#x2032;5,5&#x2032;-tetraethyldiphenylmethane and 1,3-bis-(aminophenoxy)benzene, and n is a repeating number and represents a positive number of 10 to 1000) and has a lead frame comprising copper or 42 alloy, a semiconductor device having said primer resin layer between a lead frame comprising copper or 42 alloy and a cured product of a sealing resin, and a semiconductor sealing epoxy resin composition containing said primer resin; and said semiconductor device has an extremely improved adhesiveness between said lead frame and a cured product of a sealing resin composition and also is excellent in heat resistance and low moisture absorption.

Primer resin for semiconductor device and semiconductor device

This invention provides resins and resin compositions which afford cured products with high heat resistance, low water absorption and high adhesion which are useful as electric and electronic materials. Resins obtained by condensation reaction between 4,4'-di(.omega.-substituted methyl)biphenyl or the like and naphthols; epoxy resins obtained by glycidyleterifying said resins; epoxy resin compositions containing these resins; and cured products thereof are disclosed.

Naphthalene ring-containing resins, resin compositions and cured

A method of producing liposomal products which comprises treating a positively or negatively charged, freeze- or spray-dried liposomal preparation with an aqueous solution of a drug charged oppositely to the charge of the liposomes.

Method of producing liposomal products from freeze or spray-dried

Phenolic novolak resins, cured substances therefrom and method for

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Tokyo, Japan

Hiromi Morita