Matsushita Electric Industrial Co., Ltd.

Hiromi Kinoshita

Hideaki Watanabe

Kiyoshi Imai

Dai Yokoyama

Yuzuru Inaba

Yoshinobu Maeda

Tadashi Tanno

Takaharu Mae

Toshiyuki Koyama

Hiroshi Nakagawa

Koji Fujiwara

Tatsuya Shimoyama

Kouji Fujiwara

Kouji Hiramoto

An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.

Mounting apparatus for electronic component

An apparatus for mounting a wire component on a substrate has a feed device for feeding a wire a predetermined length intermittently, and an insert device for cutting the wire fed out by the feed device, bending the cut wire to form a wire component, rotating and positioning the wire component, and then inserting the wire component in a hole defined in the substrate. In particular, irrespective of a position of the insert device, the feed device feeds out the wire in a direction where no interference would occur between the feed device and the insert device.

Apparatus for mounting a wire component

An axial type electronic component inserting apparatus is provided for inserting into holes of a board a pair of lead wires of each of axial type electronic components connected by a tape at regular intervals. A first kind of the components have a larger tape interval and a second kind of the components have a smaller tape interval. The apparatus includes a pair of centering chucks having recesses for contacting both sides of the body of the component, and being movable in a symmetrical manner with respect to the center to adjust the body of the component from both sides of the main body while the recesses come in contact with both sides of the body of the component, thus resulting in centering of the component.

Axial-type electronic component inserting apparatus

In a method of inserting, into a board, axial-type electronic components, wherein each of the electronic components has a pair of lead wires extending from a main body and belongs to an assembly of electronic components connected by a tape as arranged at regular intervals, the components are grasped with a plurality of chucks which are intermittently moved to a component supplying position and a component transferring position, respectively. Each of these chucks comprises grasping pieces having first and second grasping grooves, the first grasping grooves having inner surfaces for grasping end portions of each of a first kind of the components whose taped portions are of a first tape interval, the second grasping grooves having inner surfaces for grasping end portions of each of a second kind of the components whose taped portions are of a second tape interval smaller than the first tape interval, the second grasping grooves being slightly deeper than the first grasping grooves. The method includes a first process for taking out one of the components from a component supplying device while preventing the second grasping grooves from contacting the lead wires of the component when the lead wires of the component are grasped by the first grasping grooves when the component grasped by the chuck is the first kind of the component, and a component delivering process.

Axial-type electronic component inserting method

An inserting apparatus inserts, into specified holes of a board, an axial type electronic component having a pair of lead wires extending from a main body and belonging to an assembly of electronic components which are connected by a tape and arranged at regular intervals. The apparatus includes chucks constructed so that the chucks can move forward and backward while grasping end portions of the axial type electronic component. A component carrying device is provided with the chucks and arranged at regular intervals in a circular form, each operating intermittently so that each chuck stops at least in a component supplying position and a component transferring position. A component supplying device is provided with a cutter for cutting the tape connecting the assembly of axial type electronic components, and operates to supply each axial type electronic component to each chuck located in the component supplying position. A component transferring device receives each axial type electronic component from each chuck located in the component transferring position and transfers the axial type electronic component to a component inserting position. A component inserting device receives the axial type electronic component from the component transferring device in the component inserting position, inserts both the ends of the lead wires into the specified holes of the board, and bends the lead wires underneath the board so as to fix the axial type electronic component to the board.

Axial type electronic component inserting method and apparatus

Insertion guides are mounted to slide blocks supported by a guide to be close to or away from each other. The slide blocks are meshed with nut parts of a ball screw threaded in both directions. When the ball screw is rotated via a driving pulley, a belt, and a driven pulley by a rotating/driving device set in an insertion head, the slide blocks and insertion guides mounted to the slide blocks are moved, so that an insertion pitch is changed. When the insertion head is rotated by a rotating/driving device via a driving pulley, a belt, and a driven pulley, an insertion direction is changed as well.

Method and apparatus for inserting electronic component

An axial type electronic component inserting apparatus inserts into specified holes of a board an axial type electronic component having a pair of lead wires. The apparatus includes chucks constructed so that the chucks can move forward and backward while grasping end portions of the axial type electronic component, a component carrying device which is provided with the chucks arranged at regular intervals in a circular form, a component supplying device which is provided with a cutter for cutting the tape connecting the assembly of axial type electronic components and operates to supply each axial type electronic component to each chuck located in the component supplying position, a component transferring device which receives each axial type electronic component from each chuck located in the component transferring position and transfers the axial type electronic component to a component inserting position, and a component inserting device inserts both the ends of the lead wires into the specified holes of the board, and bends the lead wires underneath the board so as to fix the axial type electronic component to the board.

Axial type electronic component inserting apparatus

A substrate supply apparatus includes a substrate-accommodating section for accommodating a substrate on which electronic components are to be mounted, a substrate-width-adjusting device, a transporting device, a substrate-sucking device, and an elevating device. The accommodating section has substrate-width-regulating sections a distance between which can be adjusted in a width direction of the substrate. The adjusting device adjusts the distance between the regulating sections by moving one of the regulating sections in the width direction. The transporting device is supported by the regulating sections, has a pair of rails, is arranged above the accommodating section, and transports the substrate to an electronic component-mounting apparatus. The sucking device has a long substrate-sucking arm and a plurality of short substrate-sucking arms. Each of the substrate-sucking short arms is position-changeably installed on the long substrate-sucking arm. The elevating device supports and vertically moves the sucking device so that the sucking device transfers the substrate to the transporting device. The elevating device is disposed at a center of a space between the pair of rails in the width direction.

Substrate supply apparatus

A parts feeder includes a stock unit containing a plurality of magazine units arranged side by side and each storing a stack of magazines accommodating an array of parts, and a supply unit for supporting magazines delivered respectively from the magazine units in the stock unit. Parts can be supplied, one at a time, from any of the magazines in the supply unit. The supply unit is movable independently of the stock unit. When any magazine unit runs short of magazines, such a magazine unit can be supplied with new magazines loaded with parts without shutdown of the parts feeder.

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Yamanashi-ken, Japan

Hiromi Kinoshita