Chisso Corporation

Hiromi Egawa

Kouichi Kunimune

Shiro Konotsune

Yoshiya Kutsuzawa

A process for producing a silicon-containing polyamic acid of a specified inherent viscosity as a precursor affording polyimide resins having a considerable extent of heat resistance as adhesives or resins for multilayer laminated composite materials, and a good adhesion onto inorganic materials, metals or resins, and a crosslinked silicon-containing polyimide resin prepared from the polyamic acid are provided, which process comprises reacting a tetracarboxylic acid dianhydride of formula (1) (A mols), a diamine of formula (2) (B mols) and an aminosilicon compound of formula (3) (C mols), satisfying the expressions of (4) and (5): ##STR1## wherein R.sup.1 is a tetravalent carboxylic aromatic group; R.sup.2 is an aliphatic, alicyclic, aromatic aliphatic or carboyclic aromatic group each of a specified number of carbon atoms, a specified polysiloxane group, or a formula of ##STR2## wherein R.sup.8 is a specified hydrocarbon group or hydrogen atom; ##STR3## (s: 1 to 4); R.sup.4 is alkyl, phenyl or alkyl-substituted phenyl each of a specified number of carbon atoms; X is alkoxy, acetoxy or halogen; and 1.ltoreq.k.ltoreq.3, and which polyimide resin is produced by baking a solution containing the above polyamic acid at 50.degree. to 450.degree. C.

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Yokohamashi, Japan

Hiromi Egawa