Kabushiki Kaisha Toshiba

Jsr Corporation

Hiromi Aoi

Nobuo Kawahashi

Hiroshi Shiho

Seiji Yamamoto

Yumi Yaita

Kou Hasegawa

Masami Enda

Hitoshi Sakai

Ichiro Inami

Norihisa Saito

Yutaka Uruma

Yoshinari Takamatsu

Teruki Fukumatsu

Satoshi Hiraragi

A radioactive substance is effectively suppressed by an oxide-film removal step of removing an oxide film on a metallic material surface with which a coolant containing the radioactive substance comes in contact, and a titanium-oxide deposition step of depositing a titanium oxide on the metallic material surface after the oxide film has been removed.

Method of and system for suppressing deposition of radioactive substance

Chemical decontamination method of dissolving oxide film adhered to contaminated component including, preparing decontamination solution in which ozone is dissolved and oxidation additive agent, which suppresses corrosion of metal base of the contaminated component, is added, and applying the decontamination solution to the contaminated component, thereby to remove the oxide film by oxidation.

Method for treating a chemical decontamination solution

A polishing pad of the present invention contains a water-insoluble matrix material comprising a crosslinked polymer such as a crosslinked 1,2-polybutadiene and water-soluble particles dispersed in the material, such as saccharides. The solubility of the water-soluble particles in water is 0.1 to 10 wt % at 25&#xb0; C., and the amount of water-soluble particles eluted from the pad when the pad is immersed in water is 0.05 to 50 wt % at 25&#xb0; C. Further, in the polishing pad of the present invention, the solubility of the water-soluble particles in water is 0.1 to 10 wt % at 25&#xb0; C. at a pH of 3 to 11, and solubility thereof in water at 25&#xb0; C. at a pH of 3 to 11 is within &#xb1;50% of solubility thereof in water at 25&#xb0; C. at a pH of 7. In addition, the water-soluble particles contain an amino group, an epoxy group, an isocyanurate group, and the like. This polishing pad has good slurry retainability even if using slurries different in pH and also has excellent polishing properties such as a polishing rate and planarity.

Polishing pad

Growing community of inventors

Yokohama, Japan

Hiromi Aoi