Shimadzu Corporation

Hiromasa Maruno

Hideaki Katsu

Yasushi Kondo

Takashi Ono

Naoji Moriya

Satoshi Matsuoka

Takashi Muramatsu

Masahiro Ihara

Yusuke Koga

Eri Matsutani

One mode of an optical inspection apparatus according to the present invention is an optical inspection apparatus for optically inspecting an object, the optical inspection apparatus including: a biasing section () configured to apply, to a group of objects (A) on a stage, a force for moving the group of objects away with respect to the stage (); a catching section () including an adhesion portion () to which an object in the group of objects moved from the stage adheres; and an analysis section () configured to optically analyze the object caught by the catching section. This makes it possible to efficiently and satisfactorily perform optical analysis of individual microplastics by eliminating manual work of picking up the microplastics one by one.

Optical inspection apparatus and optical inspection method

A Fourier transform infrared spectrophotometer includes a main interferometer, a control interferometer, an infrared detector, a control light detector, a waveplate, and a support member. The waveplate is disposed on an optical path of a control light beam and between a fixed mirror or a moving mirror and a beam splitter. The support member supports the waveplate. An outer perimeter of the waveplate includes a supported region supported by the support member and a released region spaced apart from the support member.

Fourier transform infrared spectrophotometer

A Fourier transform infrared spectrophotometer includes a main interfersometer, a control interferometer, an infrared detector, a control light detector, and a beam splitter block. The beam splitter block is disposed between a beam splitter and the control light detector. The control light detector has an optical axis inclined with respect to an optical axis of a control interference light beam.

In a solid-state image sensor according to this invention, an image signal temperature variation suppressing unit changes a voltage value of a driver voltage applied to multiplying registers in response to variations in sensor temperature of a CCD image sensor. Thus, a charge multiplication gain of a charge multiplying unit is electrically controlled to suppress variations in signal strength of image signals due to the variations in the sensor temperature of the CCD image sensor. As a result, without relying on thermal control with which it is very difficult to realize high precision control, variations in the signal strength of the image signals due to the variations in the sensor temperature of the CCD image sensor are suppressed easily by controlling the charge multiplication gain of the charge multiplying unit based on the electric control, with which it is very easy to realize high precision control, performed by the image signal temperature variation suppressing unit in response to the variations in the sensor temperature of the CCD image sensor.

Solid-state image pickup apparatus, image pickup apparatus, and image sensor

An image pick-up elementis mounted on an element mounting partformed with a member whose thermal conductivity is higher than that of an element storing partInputting and outputting pinsfor electrically connecting the image pick-up element to a control circuit boardfor controlling the image pick-up element are provided in a direction that does not interfere with the contact part of the element mounting partand a heat absorbing mechanismThus, the thermal conductivity of the image pick-up element and the heat absorbing mechanism can be improved and the area of a heat absorbing part can be increased. As a result, the cooling capability of the element is increased so that the image pick-up element can be driven under a condition at higher speed than usual.

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Kyoto-fu, Japan

Hiromasa Maruno