Kabushiki Kaisha Toshiba

Toshiba Materials Co., Ltd.

Sony Corporation

Olympus Medical Systems Corporation

Mitsubishi Chemical Corporation

Mitsubishi Kasei Corporation

Hiromasa Kato

Takayuki Naba

Keiichi Yano

Takashi Sano

Noboru Kitamori

Masashi Umehara

Yoshiyuki Fukuda

Noritaka Nakayama

Masahiro Aoki

Kenichi Obinata

Masayuki Tatewaki

Yusuke Shiota

Masanori Hoshino

Kotaro Yamada

Hideki Sato

Michiyasu Komatsu

Hideaki Hirabayashi

Akito Sasaki

Hiromichi Horie

Tomohiro Tsuji

Nobuaki Nakashima

Fumiyuki Kawashima

Kimiya Miyashita

Chika Miyajima

Yasuhisa Makino

Akiyoshi Nozawa

Shinichi Kuwata

Yuka Fujimoto

Naoko Katayama

An endoscope treatment tool includes a sheath, a knife, a connecting unit and a body. The sheath includes a first channel opened at a distal end of the sheath. The knife inserted into the first channel, the knife having a second channel extending from a distal end of the knife to a proximal end of the knife. The connecting unit is located inside the sheath, the connecting unit including a cavity internal to the connecting unit and defining a storage path. A cross-sectional area of the cavity is larger than a cross-sectional area of the second channel. The body disposed in the cavity. The body is translatable in the cavity between a first position and a second position. The body forms a passage and, in the first position, the passage is in communication with the second channel.

Endoscope treatment tool

A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 μm or more and 150 μm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

Ceramic circuit board and semiconductor device using same

A ceramic copper circuit board according to an embodiment includes a ceramic substrate and a first copper part. The first copper part is bonded at a first surface of the ceramic substrate via a first brazing material part. The thickness of the first copper part is 0.6 mm or more. The side surface of the first copper part includes a first sloped portion. The width of the first sloped portion is not more than 0.5 times the thickness of the first copper part. The first brazing material part includes a first jutting portion jutting from the end portion of the first sloped portion. The length of the first jutting portion is not less than 0 μm and not more than 200 μm. The contact angle between the first jutting portion and the first sloped portion is 65° or less.

Method for manufacturing a ceramic copper circuit board

An endoscopic treatment device includes a sheath formed from a resin; a flow-passage formation member attached to a distal end portion of the sheath to be rotatable around a longitudinal axis of the sheath; a pair of forceps pieces supported by the flow-passage formation member such that the pair of forceps pieces are able to be opened and closed; a link mechanism connected to the pair of forceps pieces and configured to open and close the pair of forceps pieces; an operation wire extending along the longitudinal axis of the sheath; and a connection member configured to connect a proximal end arm of the link mechanism and the operation wire.

Endoscopic treatment device

An endoscopic surgical tool including a housing having a proximal end and a distal end, the housing having a central axis and a first aperture forming an opening disposed at the distal end, an insulator disposed within the housing and having a central bore and a second aperture, the insulator configured to extend distally from the first aperture along the central axis, and a knife disposed within the first aperture and including a tip. The knife having a retracted position and an extended position, wherein in the extended position, the knife is extended distally from the first aperture along the central axis and in the retracted position, the knife is retracted proximally towards the proximal end along the central axis. The endoscopic surgical tool including a biasing element coupled to the knife and biasing the knife toward the retracted position when the knife is in the extended position.

Endoscopic surgical tool

A packaging container for transporting ceramic substrates according to the present embodiment includes a bottom portion in a rectangular shape, and four side portions connected to four edges of the bottom portion respectively. Side protrusions having a height of 2 mm or more and protruding inward are provided on at least two opposite side portions among the four side portions. The bottom portion is provided with a bottom protrusion having a height of 2 mm or more and protruding inward.

Packaging container for transporting ceramic substrates

According to one embodiment, a ceramic metal circuit board is a ceramic metal circuit board formed by bonding metal circuit plates to at least one surface of a ceramic substrate. At least one of the metal circuit plates has an area of not less than 100 mmand includes a concave portion having a depth of not less than 0.02 mm within a range of 1% to 70% of a surface of the at least one of the metal circuit plates. The concave portion is provided not less than 3 mm inside from an end of the metal circuit plate.

Ceramic metal circuit board and semiconductor device using the same

A ceramic copper circuit board according to an embodiment includes a ceramic substrate and a first copper part. The first copper part is bonded at a first surface of the ceramic substrate via a first brazing material part. The thickness of the first copper part is 0.6 mm or more. The side surface of the first copper part includes a first sloped portion. The width of the first sloped portion is not more than 0.5 times the thickness of the first copper part. The first brazing material part includes a first jutting portion jutting from the end portion of the first sloped portion. The length of the first jutting portion is not less than 0 &#x3bc;m and not more than 200 &#x3bc;m. The contact angle between the first jutting portion and the first sloped portion is 65&#xb0; or less.

Ceramic copper circuit board and method for manufacturing the same

According to one embodiment, a method for manufacturing a ceramic circuit board is disclosed. The ceramic circuit board includes a copper plate bonded to at least one surface of a ceramic substrate via a brazing material layer including Ag, Cu, and a reactive metal. The method includes: preparing a ceramic circuit board in which a copper plate is bonded on a ceramic substrate via a brazing material layer, and a portion of the brazing material layer is exposed between a pattern shape of the copper plate; a first chemical polishing process of chemically polishing the portion of the brazing material layer; and a first brazing material etching process of etching the chemically polished portion of the brazing material layer by using an etchant having a pH of 6 or less and including one type or two types selected from hydrogen peroxide and ammonium peroxodisulfate.

Method for manufacturing ceramic circuit board

According to one embodiment, a ceramic copper circuit board a ceramic substrate, a copper circuit board provided at one surface of the ceramic substrate. A ratio of a thickness of the copper circuit board to a thickness of the ceramic substrate is 1.25 or more. A number of grain boundaries is not less than 5 and not more than 250 along every 10-mm straight line drawn in a front surface of the copper circuit board.

Ceramic copper circuit board and semiconductor device based on the same

A ceramic circuit board comprises: a ceramic substrate with a 1.0 mm thickness or less including a first surface and a second surface, the first surface including a first area and a second area; a first metal plate joined to the first area; and a second metal plate joined to the second surface. The second area has a first waviness profile along a first side of the first surface, the first waviness profile having one extreme value or less. The second area has a second waviness profile along a second side of the first surface, the second waviness profile has not less than two nor more than three extreme values.

Ceramic circuit board and semiconductor module

The present invention provides a ceramic metal circuit board including a ceramic substrate and metal plates bonded to both surfaces of the ceramic substrate through respective bonding layers, wherein a metal film is provided on a surface of one metal plate bonded to one surface of the ceramic substrate; and at least a part of another metal plate bonded to another surface of the ceramic substrate is not provided with the metal film. Preferably, a protruding portion is formed as a portion of the bonding layer so as to protrude from a side surface of each of the metal plates. According to the above-described configuration, it is possible to provide a ceramic circuit board which is easy to use according to the parts to be bonded and is excellent in heat-cycle resistance characteristics.

A circuit board includes: a ceramic substrate that has a first surface and a second surface; a first metal part that has a first metal plate joined to the first surface and a protrusion projecting from a front surface of the first metal plate; and a second metal part that has a second metal plate joined to the second surface. When the ceramic substrate is equally divided into first to third sections along a longer side direction, V, V, V, V, V, and Vare numbers satisfying formula V/V+V/V&#x2264;2(V/V), 0.5&#x2264;V/V&#x2264;2, 0.5&#x2264;V/V&#x2264;2, and 0.5&#x2264;V/V&#x2264;2.

Growing community of inventors

Nagareyama Chiba, Japan

Hiromasa Kato