Jfe Steel Corporation

Mitsubishi Materials Corporation

Hiromasa Hayashi

Atsushi Yamamoto

Masaki Kobayashi

Yoshirou Kuromitsu

Takeshi Kitahara

Sotaro Oi

Tomoya Oohiraki

Hiroshi Tonomura

Hiroya Ishizuka

Kimihito Nishikawa

Rinya Kojo

Shinichiro Aoe

Daijiro Yuasa

Satoshi Oro

Yohei Takanaga

Masaji Tomiyama

Adhesive matter remaining at the end of a cuboid metal material is reliably removed in a relatively short time while suppressing the decrease in yield rate of the metal material. Distances of the upper surface and the lower surface of a cuboid metal material from a reference position are measured using a distance measurement device in the longitudinal direction of the slab including the longitudinal end of the slab. On the basis of the measurement results, the state of remaining of adhesive matter remaining on the upper and lower surfaces of the longitudinal end of the slab is comprehended. On the basis of the state of remaining of adhesive matter, the amount and position of cutting by a cutting tool is determined. Corner removing cutting is performed on the upper and lower surfaces of the longitudinal end of the slab using the cutting tool in accordance with the determined amount and position of cutting.

Method of cutting and removing adhesive matter at end of cuboid metal material and removal apparatus

A method of manufacturing power-module substrates, after bonding copper-circuit platesat intervals on a ceramic platehaving an area in which ceramic substrates can be formed abreast, by dividing the ceramic platebetween the copper-circuit plates, in which: bonding-material layersof active-metal brazing material having same shapes as outer shapes of the copper-circuit platesare formed on the ceramic plate; temporal-stick materialincluding polyethylene glycol as a major ingredient is spread on the copper-circuit plates, the bonding-material layersand the copper-circuit platesare temporarily fixed on the ceramic platein a state of laminating with positioning by the temporal-stick material; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.

Manufacturing method of power-module substrate

A power module substrate having a heatsink, includes: a power module substrate having an insulating substrate having a first face and a second face, a circuit layer formed on the first face, and a metal layer formed on the second face; and a heatsink directly connected to the metal layer, cooling the power module substrate, wherein a ratio B/A is in the range defined by 1.55&#x2266;B/A&#x2266;20, where a thickness of the circuit layer is represented as A, and a thickness of the metal layer is represented as B.

Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrate

The present invention relates to a production method for a hot rolled strip in a hot rolling line. An object of the present invention is to ensure stable running of a hot rolled strip on a hot runout table, and to prevent excessive displacement of the hot rolled strip above a pass line, and, for example, a head folding defect and a tail folding defect resulting from the displacement. In the method of the present invention, a fluid jet is squirted above a hot rolled strip conveyed by a hot runout table so as to pass over the hot rolled strip running without touching a surface of the hot rolled strip running on a pass line (a strip-conveying surface of the hot runout table). A strip portion displaced upward from the pass line beyond a predetermined level collides with the fluid jet, and the displacement of the strip portion is thereby corrected. Since the fluid jet passes over the normally running hot rolled strip without touching therewith, the strip portion is properly prevented from being displaced by squirting the fluid jet.

Process for producing hot-rolled steel strip and apparatus therefor

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Tokyo, Japan

Hiromasa Hayashi