Hitachi Chemical Company, Ltd.

Resonac Corporation

Hirokuni Ogihara

Takashi Yamamoto

Hikari Murai

Shinya Nakamura

Daisuke Fujimoto

Fumio Furusawa

Yutaka Nomura

Norihiko Sakamoto

Takatoshi Ikeuchi

Yusuke Watase

An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), Rrepresents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each Rmay be the same as or different from another R. n represents an integer from 0 to 10. In Formula (III), Rrepresents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.

Epoxy resin composition and electronic component device

A film-like epoxy resin composition includes an epoxy resin (A); a curing agent (B); a cure accelerator (C);an inorganic filler (D); and an organic solvent (E). The film-like epoxy resin composition satisfies all the following requirements (1) to (4): (1) at least one of the epoxy resin (A) and the curing agent (B) contains a component being a liquid at 25&#xb0; C. in an amount of 30% by mass or more based on the total mass of the epoxy resin (A) and the curing agent (B); (2) the content of a volatile portion that volatilizes by being heated at 180&#xb0; C. for 10 minutes is 0.2% to 1.5% by mass based on the total amount of the epoxy resin composition; (3) the minimum melt viscosity in temperature rising from 40&#xb0; C. to 200&#xb0; C. is 800 Pa&#xb7;s or less; and (4) the film thickness is 50 to 500 &#x3bc;m.

Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device

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Hirokuni Ogihara