Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hirokuni Miyazaki

Shoriki Narita

Shuichi Hirata

Satoshi Shida

Kanji Hata

Takafumi Tsujisawa

Youhei Matsumoto

In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an expanding ring and a lower face of the wafer sheet and allows efficient and uniform processing. Moreover, setting the height position so as to avoid the contact between the wafer sheet and the upper end portion of the expanding ring at least when the slack removal processing is completed reliably prevents shrinking operation of the wafer sheet from being disturbed by the contact between the wafer sheet and the upper end portion.

Wafer expanding device, component feeder, and expanding method for wafer sheet

In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.

Component feeding head apparatus, for holding a component arrayed

Growing community of inventors

Osaka, Japan

Hirokuni Miyazaki