Nitto-denko Corporation

Hirokuni Hashimoto

Fumiteru Asai

Yoshio Terada

Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

Pressure-sensitive adhesive sheet for testing

A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.

Growing community of inventors

Ibaraki, Japan

Hirokuni Hashimoto