Mitsui Chemicals, Inc.

Seiko Epson Corporation

Hiroko Wachi

Hirofumi Tanaka

Yasuhisa Kayaba

Shoko Ono

Koji Inoue

Hiroshi Maekawa

Yukiko Egami

Kenichi Fujii

Tsuyoshi Sano

Takayoshi Kagata

Akira Mizutani

Atsushi Denda

Tsuneji Suzuki

Takashi Oda

Norio Nakayama

Toshihiro Yoshimura

Mitsuru Sadamoto

Keiji Ueno

Hisanori Ohkita

Yasuyuki Kagawa

Shingo Yamamoto

Provided is a photocurable composition used for forming a resin layer of a concave-convex structure including a substrate and a resin layer provided on the substrate and having fine concavities and convexities formed on a surface thereof. A cured film of the photocurable composition has a surface free energy of 15 mJ/mto 40 mJ/mas measured based on the Kitazaki-Hata theory and a hardness of 0.05 GPa to 0.5 GPa as measured using a nanoindenter.

Photocurable composition, method for producing concave-convex structure, method for forming fine concave-convex pattern, and concave-convex structure

Provided are a semiconductor element intermediate including: a substrate and a multilayer resist layer, in which the multilayer resist layer includes a metal-containing film, and in which the metal-containing film has a content of germanium element of 20 atm % or more, or a total content of tin element, indium element, and gallium element of 1 atm % or more, as measured by X-ray photoelectric spectroscopy, and an application of the semiconductor intermediate.

Semiconductor element intermediate, composition for forming metal-containing film, method of producing semiconductor element intermediate, and method of producing semiconductor element

A substrate intermediary body includes: a substrate having a hole in a thickness direction, and a conductor being disposed in the hole; and an adhesion layer formed on a wall surface of the hole. The adhesion layer contains a reaction product of a polymer (A) having a cationic functional group and having a weight-average molecular weight of from 2,000 to 1,000,000 and a polyvalent carboxylic acid compound (B) having two or more carboxyl groups per molecule or a derivative thereof.

Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method

A composition for forming a film for semiconductor devices including: a compound (A) including a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and having a weight average molecular weight of from 10,000 to 400,000; a crosslinking agent (B) which includes the three or more &#x2014;C(&#x2550;O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more &#x2014;C(&#x2550;O)OX groups are &#x2014;C(&#x2550;O)OH groups, and which has a weight average molecular weight of from 200 to 600; and water (D), in which the compound (A) is an aliphatic amine.

Semiconductor film composition, method of manufacturing semiconductor film composition, method of manufacturing semiconductor member, method of manufacturing semiconductor processing material, and semiconductor device

The invention provides a sealing composition including: polymer (A) containing a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000; and a benzotriazole compound; in which the content of the polymer (A) is from 0.05 parts by mass to 0.20 parts by mass with respect to 100 parts by mass of the sealing composition; in which the content of the benzotriazole compound in the sealing composition is from 3 ppm by mass to 200 ppm by mass; and in which the sealing composition has a pH of from 3.0 to 6.5.

Sealing composition and method of manufacturing semiconductor device

A method for manufacturing a filling planarization film, the method including: a first coating step of applying a first coating liquid, containing a polyamine and a first solvent, to a region including a recessed part of a member having the recessed part, to fill the first coating liquid into the recessed part; and a second coating step of applying a second coating liquid, containing an organic substance having two or more carboxyl groups and a second solvent having a boiling point of 200&#xb0; C. or less and an SP value of 30 (MPa)or less, to the region including the recessed part of the member into which the first coating liquid has been filled.

Method for manufacturing filling planarization film and method for manufacturing electronic device

An ink composition includes a white coloring material, polymer particles, and a solvent, the polymer particles satisfying the relationship represented by the following expression (1).&#x2266;0.33+20&#x2003;&#x2003;(1)

Ink composition

A gas generating device for generating an oxygen gas and/or a hydrogen gas from an electrolytic solution containing water, including an anode electrode, a cathode electrode, a plurality of through holes and a gas containing unit. The anode electrode (photocatalyst supporting electrode) has a photocatalyst-containing layer containing a photocatalyst producing an oxygen gas from the electrolytic solution by a photocatalytic reaction. The cathode electrode produces a hydrogen gas from electrons and hydrogen ions that are generated in the electrolytic solution by the photocatalytic reaction at the photocatalyst-containing layer. The through holes are formed on at least one of the anode electrode and the cathode electrode, and the through holes allow the produced oxygen gas or hydrogen gas to pass therethrough, but do not allow the electrolytic solution to pass therethrough. The gas containing unit holds the oxygen gas or hydrogen gas that has passed through the through holes.

Gas generating device and method for generating gas

The aqueous ink white pigment of the present embodiment contains a metal compound (1) which satisfies the following specific conditions of (A), (B), and (C).

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Chiba, Japan

Hiroko Wachi