Kabushiki Kaisha Toshiba

Hiroko Miki

Kentaro Kobayashi

Naofumi Nakamura

Michihiko Nishigaki

Hiroshi Hamasaki

Yoshiaki Sugizaki

Yutaka Onozuka

Atsunobu Isobayashi

Hideto Furuyama

Akihiro Kojima

Makoto Wada

Hideyuki Tomizawa

Yumi Hayashi

A chemical sensor device includes a sensor element; an oligopeptide mounted on a surface of the sensor element, the oligopeptide containing a first peptide sequence forming a β-sheet structure and a cysteine residue at a position different from the first peptide sequence; and a probe that is bonded to the cysteine residue and binds to or reacts with a specific substance.

Chemical sensor device and method for manufacturing the same

A method for inspecting probe molecule includes evaluating the formation of the probe molecule at the surface of the graphene by comparing an intensity ratio a1/b1, and an intensity ratio a2/b2. The intensity a1 is of a peak of the first Raman spectrum having a peak top positioned in a first band of not less than 1200 cmand not more than 1500 cm. The intensity b1 is of a peak of the first Raman spectrum having a peak top positioned in a second band of not less than 1510 cmand not more than 1800 cm. The intensity a2 is of a peak of the second Raman spectrum having a peak top positioned in the first band. The intensity b2 is of a peak of the second Raman spectrum having a peak top positioned in the second band.

Method for inspecting probe molecule

According to one embodiment, a molecule detecting device includes a capturing section, a releasing section, and a detecting section. The capturing section is configured to, by combining a target molecule and a solubilizing agent with each other and thereby creating a composite body, capture the target molecule in a carrier liquid. The releasing section is configured to make the composite body release the target molecule therefrom in the carrier liquid. The detecting section is configured to carry out detection of the target molecule in the carrier liquid.

Molecule detecting device and molecule detecting method

According to one embodiment, a particle inspection system includes a voltage driving circuit which applies a driving voltage for a particle inspection to a particle inspection chip, a current-voltage conversion circuit which converts, into a voltage signal, a current signal output from the particle inspection chip when the driving voltage is applied to the particle inspection chip, a detection circuit which detects, based on the voltage signal, whether the sample liquid is introduced into a detection region of the particle inspection chip, and an analysis circuit which analyzes the fine particle, in the sample liquid based on the voltage signal. The voltage driving circuit varies the driving voltage based on the detection result of the detection circuit.

Particle inspection system and driving method employed therein

One of embodiments is a semiconductor micro-analysis chip for detecting particles in a sample liquid. The chip comprises a semiconductor substrate, a first flow channel provided on the semiconductor substrate to allow the sample liquid to flow therein, a second flow channel provided at a different position from the first flow channel of the semiconductor substrate to allow the sample liquid or an electrolyte solution to flow therein, a contact portion where a portion of the first flow channel and a portion of the second flow channel abut each other or intersect one another with a partition being arranged between the flow channels, and a fine hole provided on the partition of the contact portion to allow the particles to pass therethrough.

Semiconductor micro-analysis chip and method of manufacturing the same

According to one embodiment, an analysis package, including a board, an analysis chip provided on the board, the chip including a detector for detecting a particle, a flow channel of a sample liquid, and a liquid receiver of the sample liquid, a first mold layer provided on the analysis chip, the first mold layer including an opening above the liquid receiver, and a second mold layer provided on the board and the first mold layer, the second mold layer including an opening above the opening of the first mold layer, wherein the respective openings of the first and second mold layers are connected above the liquid receiver to allow the sample liquid to be introduced into the liquid receiver from outside.

Analysis package for detecting particles in a sample liquid

According to one embodiment, an analysis package including an analysis chip provided on a main surface of a semiconductor substrate, the chip including a flow channel, both ends of which are open at peripheral parts of the substrate, and a microaperture which is provided in a middle of the flow channel and which allows a particle to pass therethrough, a package board on which the chip is mounted, liquid receivers provided on the package board, the liquid receivers being connected to openings, and electrodes, at least parts of which are provided on parts of bottom surfaces of the liquid receivers, the electrodes being provided at positions corresponding to an upstream side and a downstream side of the microaperture.

Analysis package for detecting particles in a sample liquid including an analysis chip mounted on a package board

According to one embodiment, an analysis package including a board including an electrical terminal, an analysis chip provided at the board, the chip including a detector for detecting a particle, a flow channel of a sample liquid for particle detection to the detector, and a liquid receiver for introducing the sample liquid into the flow channel, a mold provided to cover the board on which the analysis chip is provided, the mold comprising an opening above the liquid receiver, a first shield layer provided on a back surface of the board, and a second shield layer provided to be attachable and detachable on an opposite side to the analysis chip of the mold, the second shield layer being electrically connected to a part of the electrical terminal.

Analysis package for detecting particles in a sample liquid, and including shield layers

In one embodiment, a semiconductor device including a substrate provided with a semiconductor element, and first and second interconnects provided above the substrate, each of the first and second interconnects having a line shape in a plan view, and the first and second interconnects being substantially parallel to each other. The device further includes a first via plug provided above the substrate, electrically connected to a lower surface of the first interconnect on a second interconnect side, and including a first recess part at an upper end of the first via plug under a first region between interconnects, the first region between interconnects being a region between the first interconnect and the second interconnect. The device further includes a via layer insulator provided above the substrate and including the first via plug, and a first trench under the first region between interconnects, the first trench including a region adjacent to the first via plug in a width direction of the first and second interconnects. Furthermore, an air gap is included in the first region between interconnects and in the first trench.

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Kawasaki Kanagawa, Japan

Hiroko Miki