3m Innovative Properties Company

Hiroko Akiyama

Brant Ulrick Kolb

Eric G Larson

Kohichiro Kawate

Naota Sugiyama

Yorinobu Takamatsu

Yoshiteru Kakinuma

A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.

Semiconductor package resin composition and usage method thereof

An adhesive composition is disclosed that comprises acrylic adhesive particles having an average diameter of 10 to 100 micrometers obtained by suspension polymerization of an acrylic monomer mixture which comprises a branched C 14-22 alkyl group containing (meth)acrylate and a polar monomer. The adhesive composition may be applied to an adhesive dressing or patch. The adhesive has excellent water vapor permeability, excellent adhesion to skin with low skin irritation when applied, less adhesive residue after peeling, and less keratin damage. The adhesive does not cause wetness or peeling from sweat while being worn.

Adhesive composition

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Sagamihara, Japan

Hiroko Akiyama