Kabushiki Kaisha Toyota Jidoshokki

National University Corporation Nagaoka University of Technology

Hiroki Watanabe

Harumitsu Sato

Shogo Mori

Naoki Kato

Hiroshi Yuguchi

Junichi Itoh

Takahiro Suzuki

Yasuhiro Koike

Kiminori Ozaki

Hiroaki Asano

Tomoaki Asai

Hitoshi Shimadu

Yuri Otobe

Ryou Yamauchi

Takahiro Hayakawa

Tadayoshi Kachi

Tetsuya Furuta

Masao Miyake

Kenichi Nagayoshi

Takehiko Sumida

Koji Nishimura

A power conversion device includes two input terminals, a first converter, and two first output terminals configured to output power converted by the first converter. The first converter includes a switching circuit, a flying capacitor, and a reactor. The power conversion device includes a second converter configured to perform power conversion on a voltage across the flying capacitor as an input voltage, two second converter input terminals electrically connected to two ends of the flying capacitor, and two second output terminals configured to output power converted by the second converter. The second converter includes a primary-side circuit and a secondary-side circuit. The second converter is an isolated DC/DC converter in which the primary-side circuit and the secondary-side circuit are electrically isolated from each other.

Power conversion device

A semiconductor module includes a substrate, two bare chips (semiconductor elements) mounted on the substrate, and a case fixed to the substrate. A conductor pattern and five signal patterns are provided for each bare chip on an upper surface of an insulating substrate. Signal electrodes and the signal patterns of the bare chips are connected to by conductive plates. An insulating member is provided on connecting portions of the conductive plates.

Semiconductor module

A semiconductor module includes a wiring substrate and two semiconductor devices mounted on the wiring substrate. The semiconductor module includes a housing having a rectangular frame body including four side walls. The housing includes a beam that bridges first side walls. A bus bar includes two end portions, upright portions each extending from one of the end portions in the thickness direction of an insulating substrate, bent portions each extending continuously with one of the upright portions, and an extension extending continuously with the bent portions. A section of the extension is embedded in the housing.

An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.

Wiring board and method for manufacturing wiring board

Growing community of inventors

Kariya, Japan

Hiroki Watanabe