Sumita Optical Glass, Inc.

Toyoda Gosei Co., Ltd.

Other

Kanda Tsushin Kogyo Co., Ltd.

Hiroki Watanabe

Kazuya Aida

Yoshinobu Suehiro

Naruhito Sawanobori

Seiji Yamaguchi

Masaaki Ohtsuka

Satoshi Wada

Hideaki Kato

Koji Tasumi

Koichi Ota

Yoshinori Yamamoto

Mitsuhiro Inoue

Kunihiro Hadame

Ryoichi Tohmon

Hiroyuki Tajima

Mikio Suzuki

Miki Moriyama

Dayong Li

Takashi Nonogawa

Hiroko Sakaji

Morito Kanke

Shotaro Sano

Jun Otake

A relay optical systemfor a rigid endoscope includes a lens fixing frameand a plurality of lenses. The lens fixing framehas a plurality of tubular bodies. The plurality of tubular bodiesare joined coaxially to each other. The plurality of lensesare located at positions other than a joint position jp of the tubular bodiesin an axis direction of the lens fixing frame. The plurality of lensesare located in the lens fixing frameso as to have a coincident optical axis. The plurality of lensesdo not include a cemented lens.

Relay optical system for rigid endoscope

To provide an optical system that lengthens the lifetime of a fiber, an optical systemguides light beams emitted from a plurality of light emitting parts ep into a single optical fiber, the plurality of light emitting parts ep are arranged to be aligned along a first direction d, and the optical systemallows the light beams emitted from the plurality of light emitting parts ep to have different light collection centers which are offset from each other at least in a second direction d

Optical system

A method of manufacturing a light-emitting device including a light-emitting element mounted on a substrate and sealed with a glass. The method includes heating the glass by a first mold that is heated to a temperature higher than a yield point of the glass, the glass contacting the first mold, and pressing the glass against the light-emitting element mounted on the substrate supported by a second mold to seal the light-emitting element with the glass.

Method of manufacturing light-emitting device

A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.

Solid element device and method for manufacturing the same

A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO&#x2014;NbO-based, BO&#x2014;F-based, PO&#x2014;F-based, PO&#x2014;ZnO-based, SiO&#x2014;BO&#x2014;LaO-based, and SiO&#x2014;BO-based low melting glasses.

A method of manufacturing a light-emitting device includes, when sealing a light-emitting element on a mounting portion by a glass material softened by heating or when processing the glass material after the sealing, producing a concave portion partially on the glass material by partially contacting and pressing a die against an upper surface of the glass material such that a part of the upper surface being not in contact with the die is deformed and forms a curved surface.

A solid state device has a solid state component, a power receiving/supplying portion that mounts the solid state component thereon for receiving/supplying electrical power from/to the solid state component, and a glass sealing portion that seals the solid state component. The glass sealing portion is formed of a BO&#x2014;SiO&#x2014;LiO&#x2014;NaO&#x2014;ZnO&#x2014;NbObased glass, which is composed of 21 wt % to 23 wt % of BO, 11 wt % to 13 wt % of SiO, 1 wt % to 1.5 wt % of LiO, and 2 wt % to 2.5 wt % of NaO.

Solid state device

A method of making a light emitting device includes mixing a glass powder with a phosphor powder including at least one of a sulfide phosphor, an aluminate phosphor and a silicate phosphor to produce a mixed powder in which the phosphor powder is dispersed in the glass powder, heating and softening the mixed powder to provide an integrated material, and subsequently solidifying the integrated material to provide a phosphor-dispersed glass, and fusion-bonding the phosphor-dispersed glass onto a mounting portion on which a light emitting element is mounted by hot pressing, and simultaneously sealing the light emitting element with the phosphor-dispersed glass on the mounting portion.

Method of making phosphor containing glass plate, method of making light emitting device

A method for manufacturing a solid element device, which comprises providing a glass-containing AlOsubstrate () having a GaN based LED element () placed thereon, setting a PO&#x2014;ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415&#xb0; C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 10poise, and is adhered via an oxide formed on the surface of the glass-containing AlOsubstrate (). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.

A solid-state element device having: a solid-state element; a power receiving/supplying portion for mounting thereto the solid-state element, and receiving/supplying a power from/to the solid-state element; and a wavelength converting portion having a phosphor layer formed inside a sealing glass having the same coefficient of thermal expansion as that of the power receiving/supplying portion for sealing the solid-state element, the phosphor layer being obtained by mixing a glass and a phosphor with each other, and melting the glass.

Solid-state element device and light-emitting apparatus using same

A solid-state optical device includes a solid-state element, a power supplying/retrieving portion on which the solid-state element is mounted, the power supplying/retrieving portion supplying or retrieving electric power to/from the solid-state element, and a glass sealing material that seals the solid-state element. The glass sealing material has a thermal expansion coefficient equivalent to that of the power supplying/retrieving portion. The glass sealing material includes a PO&#x2014;AlO&#x2014;ZnO-based low-melting glass that includes 55 to 62 wt % of PO, 5 to 12 wt % of AlOand 20 to 40 wt % of ZnO in weight %.

Solid-state optical device

A solid-state optical device having: a solid-state element; a power supplying/retrieving portion that supplies or retrieves electric power to/from the solid-state element; and a glass sealing material that seals the solid-state element. The glass sealing material is made of a PO&#x2014;ZnO-based low-melting glass that has 45 to 50 wt % of POand 15 to 35 wt % of ZnO.

An ultrasonic scanning instrument uses a probe formed by arranging a plurality of oscillator pieces aligned on a flexible base plate. The oscillator pieces each transmit ultrasonic waves into a target body and receive reflected waves. Sensors are attached to the flexible base plate to detect degrees of flexure of the base plate. The flexible base plate becomes curved according to the curved contact surface of the target body and its degree of flexure measured by the sensors is incorporated into a sectional view displayed on a display device.

Ultrasonic probe and ultrasonic survey instrument

A urine occult blood test apparatus includes an insert member insertable in a working channel of a cystoscope and a urine occult blood test member provided at a tip portion of the insert member. The urine occult blood test member is covered during insertion of the insert member and exposed after the insertion. The urine occult blood test apparatus is inserted and advanced to just before the ureteral opening by using the cystoscope. It is directly observed that urine coming out from the ureteral opening is received by the tip portion of the insert member having the urine occult blood test member. Therefore, such a urine occult blood test enables to confirm which is bleeding, the right or left kidney or the right or left ureter.

Growing community of inventors

Saitama-ken, Japan

Hiroki Watanabe