Other

Aisin Aw Co., Ltd.

Hiroki Takata

Naotaka Murakami

Osamu Yamato

Kenji Suzuki

Katsuhiko Onoda

Toshio Nagata

Naoto Ogasawara

Kouji Aokie

Koji Aoike

An automatic transmission control unit cooling apparatus includes a control unit having an electronic component, installed on a substrate, for controlling the automatic transmission; a holder accommodating the substrate and within a case of the automatic transmission disposed at a position that is higher than the oil surface in the automatic transmission when the transmission is installed in a vehicle and on a side face of a valve body in the transmission case. The apparatus further includes a radiator that contacts the electronic component or the substrate in order to conduct heat generated by the electronic component. At least a part of the radiator is immersed in the oil when the transmission is installed in the vehicle.

Automatic transmission control unit cooling apparatus

The present invention protects a thin wire connection from oscillation of a resin protecting an electronic circuit module from vibration, impact, and corrosion. An electronic control unit including an electronic circuit module in which a bare chip is mounted on a circuit board and a case for housing the module, is provided, wherein the case is filled with a potting gel to protect the module. The bare chip, including its wire connection to the circuit board, is sealed in advance with a gelatinous resin having thixotropy prior to hardening. The gelatinous substance cures to form a hardened inner layer which has a penetration that is lower than that of the filled potting gel after hardening, and functions to eliminate or substantially reduce the affect of viscoelastic oscillation of the outer layer on the bare chip and the wire connection.

Electronic control unit

In order to precisely detect positions of respective lead portions of an electronic component and to reduce the cost of production of the electronic component, the electronic component has a resinous pad portion and a plurality of terminal units embedded in the pad portion. Each of the terminal units is provided with lead portions that are disposed parallel to one another with their terminal faces exposed, and junction portions for junction between bonding wires and the lead portions are formed on the terminal faces. Corner portions are formed at predetermined sections on the terminal faces. In this case, even if resin of the pad portion has adhered to the peripheries of the terminal faces and fouled the terminal faces, since the lead portions have the corner portions, images of the lead portions can be detected precisely. Accordingly, the operation of connecting the bonding wires to the terminal faces is performed more efficiently, whereby the cost of production of the electronic component can be reduced.

Electronic component

In an electronic control unit, a pad portion thereof is firmly fixed to a terminal plate and vibration of the terminal plate under supersonic vibration is prevented so as to secure the bonding strength between the terminal plate and the wire during wire bonding. One lead portion of each terminal plate is connected to a pin of the connector and another lead portion is wire bonded to the terminal of the circuit substrate. The leads have bent portions extending from an exposed surface to be bonded in opposite directions to be embedded in the pad portion of the case such that the lead portion of the terminal plate is firmly fixed to the case.

Growing community of inventors

Anjo, Japan

Hiroki Takata