Hitachi Chemical Company, Ltd.

Wacker-chemie Gmbh

Hiroki Sashima

Bernward Deubzer

Shinsuke Hagiwara

Peter Huber

Michael Geck

Tatsuo Kawata

Hiroyuki Saitoh

Hiroshi Suzuki

Hiroyuki Sakai

Masanobu Fujii

Naoki Nara

Takaki Kashihara

Terumi Tsukahara

Osamu Horie

Kazuhiko Miyabayashi

An LOC structure semiconductor device having a good solder heat resistance without electrical characteristic failures due to damages to the passivation film and the diffusion layer thereunder attributing to the filler can be obtained by encapsulating an LOC structure semiconductor chip with an encapsulating material comprising an epoxy resin, a curing agent, a curing promoter, and an inorganic filler, the filler having a smaller particle size than the distance between a inner lead and a semiconductor chip and being in an amount of 80 to 95% by weight based on the total weight of the encapsulating material.

Encapsulating material and LOC structure semiconductor device using the same

An epoxy resin molding material comprising an epoxy resin, a phenolic resin and a powder flexibilizer which has a core-shell structure composed of a solid silicone core and an organic polymer shell is an epoxy resin molding material for sealing electronic parts.

Semiconductor sealant of epoxy resin and organic polymer-grafted

An epoxy resin molding material comprising an epoxy resin, a phenolic resin and a powder flexibilizer which has a core-shell structure composed of a solid silicone core and an organic polymer shell is a reliable epoxy resin molding material for sealing electronic parts which is excellent in, for example, thermal shock resistance and reflow soldering resistance, and is free from the troublesome deterioration in, for example, the appearance and marking properties of molded products, and to provide a semiconductor sealed by the molding material.

Epoxy resin molding for sealing electronic parts containing organic

A resin-encapsulated semiconductor which is free from the occurrence of blisters or cracks during soldering, suits for continuous production and has excellent moisture resistance reliability is obtained by using an epoxy resin encapsulating material which comprises

Resin-encapsulated semiconductor device

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Shimodate, Japan

Hiroki Sashima