Dexerials Corporation

Sony Chemical & Information Device Corporation

Sony Corporation

Hiroki Ozeki

Tomoyuki Ishimatsu

Reiji Tsukao

Daisuke Sato

Hiroshi Hamachi

A method for manufacturing a connection structure capable of increasing the allowable range of a spacing between terminals of a component and mounting at a low temperature. The method for manufacturing a connection structure includes a disposition step of disposing, through an anisotropic conductive adhesive of a thermosetting type including conductive particles, a first electronic component including a first terminal row and a second electronic component including a second terminal row facing the first terminal row, a thermal pressurization step of thermally pressurizing the first electronic component and the second electronic component to sandwich the conductive particles between the first terminal row and the second terminal row, and a full curing step of irradiating with infrared laser light to fully cure the anisotropic conductive adhesive in a state where the conductive particles are sandwiched between the first terminal row and the second terminal row.

Method for manufacturing connection structure

The present invention provides an anisotropic conductive material in which lower continuity resistance and higher adhesive strength are obtained, and a method for manufacturing the same. When a glass substrate and a metal wiring material are thermally compressed and bonded, in an interface between the glass substrate and an anisotropic conductive material, Si on a surface of the glass substrate reacts on an alkoxyl group (OR) at an end of disulfide silane modified by hydrophobic silica, and chemically binds thereto. Furthermore, at an interface between the metal wiring material and the anisotropic conductive material, a part of S&#x2014;S bonds (disulfide bonds) in disulfide silane dissociates due to the heat at the time of thermocompression bonding, and the dissociated sulfide silane chemically binds to metal Me.

Anisotropic conductive material and method for manufacturing same

To provide a conductive particle, which contains a core particle, and a conductive layer formed on a surface of the core particle, where the core particle is formed of a resin, or a metal, or both thereof, and the conductive layer contains a phosphorus-containing hydrophobic group at a surface thereof.

Conductive particle, and anisotropic conductive film, bonded structure, and bonding method

An adhesive film, containing a first adhesive layer in which conductive particles are dispersed, and a second adhesive layer adhered to the first adhesive layer, wherein the lowest viscosity of the first adhesive layer attained at or below the curing temperature is higher than that of the second adhesive layer attained at or below the curing temperature, where the curing temperature is a temperature at which the adhesive layer starts to cure, wherein the first and second adhesive layers are respectively disposed to a substrate side and an electronic part side, and the adhesive film is configured to join the electronic part and the substrate by heating and pressurizing the substrate and the electronic part with the adhesive layer being therebetween, and wherein the first adhesive layer has a thickness which is less than two times of an average particle diameter of the conductive particles.

Adhesive film, connecting method, and joined structure

The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.

Conductive particle, anisotropic conductive film, joined structure, and joining method

A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.

Method for connecting electronic part and joined structure

An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers containing a secondary resin component, wherein the first main resin component has a glass transition temperature higher than that of the secondary resin component, and the second main resin component has a glass transition temperature higher than that of the secondary resin component and lower than that of the first main resin component, and a reaction peak temperature of each of the adhesive layers is lower than the glass transition temperature of the first main resin component and higher than the glass transition temperature of the second main resin component, and is a temperature at which a calorific value of the adhesive layer is maximum during temperature rise.

Growing community of inventors

Tochigi, Japan

Hiroki Ozeki