Kabushiki Kaisha Toshiba

Taiwan Semiconductor Manufacturing Comp. Ltd.

Toshiba Memory Corporation

Fuji Xerox Co., Ltd.

Kioxia Corporation

National Institute of Advanced Industrial Science and Technology

Hiroki Noguchi

Shinobu Fujita

Keiko Abe

Kazutaka Ikegami

Yih Wang

Ku-Feng Lin

Kumiko Nomura

Yu-Der Chih

Shy-Jay Lin

Perng-Fei Yuh

Mingyuan Song

Satoshi Takaya

Susumu Takeda

Jui-Che Tsai

Yen-Huei Chen

Hidehiro Fujiwara

William Joseph Gallagher

Chih-Yu Lin

Randy B Osborne

Fu-An Wu

Chika Tanaka

Daisuke Saida

Hsueh-Chih Yang

Win San Khwa

Hiroaki Yoda

Shih-Lien Linus Lu

Chien-Min Lee

Meng-Sheng Chang

Katsuhiko Koui

Tomoaki Inokuchi

Shinichi Yasuda

Takao Marukame

Naoharu Shimomura

Win-San Khwa

Tetsufumi Tanamoto

Yuichiro Mitani

Shinji Yuasa

Yuuzo Kamiguchi

Hsien-Yu Pan

Koichiro Zaitsu

Kazuhiko Abe

Masamichi Suzuki

Yen-Lin Huang

Wei-Chang Zhao

Yusuke Higashi

Kiyoshi Takahashi

Takayuki Nozaki

Yoshitaka Yamauchi

William J Gallagher

Yoshishige Suzuki

Shogo Itai

Kazuya Iimura

Haiyang Peng

Yoichi Shiota

Takurou Ikeura

Cheng Chun Dai

Performing refresh operation in a memory device is provided. A refresh operation without address rotation is performed in a cell array of the memory device. Performing the refresh operation without address rotation is repeated for a predetermined number of times. After repeating performing the refresh operation with address rotation for the predetermined number of times, a refresh operation with address rotation is performed in the cell array.

Memory refresh

A memory device is provided. The memory device includes several sense amplifiers and at least one reference cell. Each of the sense amplifiers has a first terminal and a second terminal. The first terminals of the sense amplifiers are coupled to a memory cell block, and the second terminals of the sense amplifiers are coupled together to transmit a read current. The at least one reference cell transmits the read current to a ground terminal. The at least one reference cell has a decreased resistance value when a number N of the sense amplifiers increases.

Structure for multiple sense amplifiers of memory device

A memory system is provided. The memory system includes a controller configured to refresh a memory array at a first temperature before a first refresh time that is acquired from a lookup table and corresponds to a time period for stored data in the memory array being lost at the first temperature. After the controller acquires a second refresh time from the lookup table, the controller resets a refresh time period to refresh the memory array before the second refresh time. The second refresh time corresponds to a time period for stored data in the memory array being lost at a second temperature different from the first temperature. The refresh time period corresponds to a time period after refreshing the memory array.

Method and system for refresh of memory devices

A magnetic memory device includes a magnetic tunnel junction (MTJ) stack, a spin-orbit torque (SOT) induction wiring disposed over the MTJ stack, a first terminal coupled to a first end of the SOT induction wiring, a second terminal coupled to a second end of the SOT induction wiring, and a selector layer coupled to the first terminal.

Magnetic device and magnetic random access memory

A memory device, such as a MRAM device, includes a plurality of memory macros, where each includes an array of memory cells and a first ECC circuit configured to detect data errors in the respective memory macro. A second ECC circuit that is remote from the plurality of memory macros is communicatively coupled to each of the plurality of memory macros. The second ECC circuit is configured to receive the detected data errors from the first ECC circuits of the plurality of memory macros and correct the data errors.

Memory error detection and correction

A memory device is disclosed. The memory device includes a plurality of memory cells arranged in a plurality of rows and a plurality of columns; a plurality of word lines, each of the word lines coupled to a corresponding row of the memory cells; a plurality of bit lines, each of the bit lines coupled to a corresponding column of the memory cells; and a plurality of second word lines, each of the second word lines coupled to a corresponding column of the memory cells.

Second word line combined with Y-MUX signal in high voltage memory program

A memory device includes: a memory cell array comprising a plurality of memory cells; a temperature sensor configured to detect a temperature of the memory cell array; a write circuit configured to write data into the plurality of memory cells; and a controller coupled to the temperature sensor and the write circuit, wherein the controller is configured to determine a target write pulse width used by the write circuit based on the detected temperature of the memory device.

Memory device with write pulse trimming

A device includes a substrate having a first side and a second side, a first transistor that includes a first gate over a first protrusion and a first source region and a first drain region interposing the first protrusion, a first buried contact disposed adjacent to the first protrusion and having at least a portion extending into the substrate, a first contact plug disposed over the first drain region, first conductive lines disposed over the first contact plug and electrically connecting to the first drain region by the first contact plug, first via penetrating through the substrate and connecting the first buried contact; and second conductive lines disposed over the second side of the substrate and electrically connecting to the first via. The first buried contact is electrically connecting to the first source region or the first gate.

Semiconductor device and method for forming the same

A memory device including a memory array with a plurality of memory macros, a power supplying circuit, and a controller is provided. The power supplying circuit is coupled to the memory array. The controller is coupled to the memory array. The power supplying circuit is configured to provide power to perform write operations to a number of the memory macros at the same time. The number of the memory macros for the write operations performed at the same time is not higher than a maximum number of the memory macros. The controller obtains the maximum number of the memory macros for the write operations performed at the same time by the power supplying circuit. The controller re-arranges a schedule for a sequence of the write operations of the memory macros to generate a re-arranged schedule. The maximum number is taken as a threshold value. In the re-arranged schedule, a number of part of the memory macros for the write operations performed at the same time is equal to or less then the threshold value.

Memory device for scheduling maximum number of memory macros write operations at re-arranged time intervals

A memory system is provided. The memory system includes a compare circuit and a control circuit. The compare circuit determines, in response to a number of detected error bits in a read data from a first memory array, whether a fail word address associated with the detected error bits is in an error table. The control circuit increments a counter value corresponding to the fail word address when the fail word address is in the error table, and further compares the counter value with a threshold value to replace memory locations, corresponding to the fail word address, in the first memory array with backup memory locations in a second memory array.

Method and system for replacement of memory cells

Disclosed herein is an integrated circuit including multiple magnetic tunneling junction (MTJ) cells coupled to a static random access memory (SRAM). In one aspect, the integrated circuit includes a SRAM having a first port and a second port, and a set of pass transistors coupled to the first port of the SRAM. In one aspect, the integrated circuit includes a set of MTJ cells, where each of the set of MTJ cells is coupled between a select line and a corresponding one of the set of pass transistors.

Non-volatile static random access memory (nvSRAM) with multiple magnetic tunnel junction cells

A sensing amplifier, coupled to at least one memory cell, includes an output terminal and a reference terminal, a multiplexer circuit, and a plurality of reference cells having equal value. An output terminal of the multiplexer circuit is coupled to the reference terminal of the sensing amplifier. Each of the reference cell is coupled to each input node of the multiplexer circuit. The multiplexer circuit is controlled by a control signal to select one of the reference cells as a selected reference cell to couple to the reference terminal of the sensing amplifier when each read operation to the at least one memory cell is performed. The plurality of reference cells are selected sequentially and repeatedly, and the one of the reference cells is selected for one read operation to the at least one memory cell.

Sensing amplifier, method and controller for sensing memory cell

A memory device is disclosed. The memory device includes at least one reference cell and multiple sense amplifiers. The at least one reference cell having a first terminal coupled to a ground. Each of the sense amplifiers has a first terminal and a second terminal. The first terminal is coupled to one of multiple first data lines, and the second terminal is coupled to a second terminal of the at least one reference cell.

An encode apparatus and an encode method may be provided. The encoding apparatus may comprise a first stage and a second stage. The first stage may be configured to receive a first input, decode the first input, and produce a first output comprising the decoded first input. The second stage may be configured to receive a second input, receive the first output from the first stage, and convert the first input and the second input from a first coding system to a second coding system based on the second input and the first output. The second stage may produce a second output comprising the converted first input and the converted second input.

Symmetry unary code encoder

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Yokohama, Japan

Hiroki Noguchi