Tokyo Electron Limited

Hiroki Niimi

Lars W Liebmann

Anton J deVillers

Daniel Chanemougame

Jeffrey Smith

Kandabara N Tapily

Subhadeep Kal

Jodi Grzeskowiak

A method of fabricating a semiconductor device is provided. The method includes forming BPR structures filled with a replacement BPR material, first S/D structures, first replacement silicide layers, and a pre-metallization dielectric that covers the first replacement silicide layers and the first S/D structures. The method also includes forming first interconnect openings in the pre-metallization dielectric and first replacement interconnect layers in the first interconnect openings. The first replacement interconnect layers are connected to the first replacement silicide layers. A thermal process is executed. The method further includes replacing, from a first side of the first wafer, a first group of the first replacement interconnect layers, a first group of the first replacement silicide layers, and the replacement BPR material, and replacing, from a second side of the first wafer, a second group of the first replacement interconnect layers, and a second group of the first replacement silicide layers.

Reverse contact and silicide process for three-dimensional semiconductor devices

Growing community of inventors

Cohoes, NY, United States of America

Hiroki Niimi