Matsushita Electric Industrial Co., Ltd.

Matsushita Electronics Corporation

Hiroki Naraoka

Kenji Maeda

Yoshiyuki Arai

Takashi Takata

Shigeru Nonoyama

Hajime Homma

Takeshi Kawabata

Takao Ochi

Yuichiro Yamada

Fumito Ito

A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Semiconductor device and method for fabricating the same

The present invention provides a printed wiring board, an IC card module including the printed wiring board, and a method for fabricating the IC card module, for improving reliability of IC cards. The printed wiring board and the IC card module of the invention include: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone; and terminals for external connection formed on the top surface of the base. The terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-claimed regions.

Printed wiring board, IC card module using the same, and method for producing IC card module

Growing community of inventors

Osaka, Japan

Hiroki Naraoka