Sumitomo Metal Mining Company, Ltd.

Sh Materials Co., Ltd.

Hiroki Nakayama

Takeshi Chonan

Hirofumi Tsunematsu

Keisuke Machida

Kenji Fukuda

Hiroshi Kobayashi

Kenichi Fujita

Keiichi Sato

Kaoru Hishiki

Hideaki Fukuyama

Shunichi Kidoguchi

Takahisa Kawano

Yukihiro Koyama

Akinari Noshita

An infrared absorbing material fine particle dispersion liquid including infrared absorbing material fine particles and a solvent, the infrared absorbing material fine particles containing fine particles of composite tungsten oxide represented by a general formula MxWOy, the solvent containing water, wherein an absolute value of a zeta potential of the infrared absorbing material fine particle dispersion liquid is 5 mV or more and 100 mV or less.

Infrared absorbing material fine particle dispersion liquid and method for production thereof

Provided are a near-infrared absorbing material fine particle dispersion, a near-infrared absorber, and a laminated structure for near-infrared absorption, which can exhibit higher near-infrared absorption property, compared to near-infrared fine particle dispersions, near-infrared absorber, and laminated structures for near-infrared absorption, containing tungsten oxides or composite tungsten oxides according to the conventional art. Also provided is a near-infrared absorbing material fine particle dispersion, wherein composite tungsten oxide fine particles, each particle containing a hexagonal crystal structure, and a silane compound are contained in an acrylic resin.

Near-infrared absorbing material fine particle dispersion body, near-infrared absorbing body, near-infrared absorbing substance laminated body and combined structure for near infrared absorption

A near-infrared absorbing material fine particle dispersion, a near-infrared absorber laminate, and a laminated structure for near-infrared absorption can exhibit higher near-infrared absorption property, compared to near-infrared fine particle dispersions, near-infrared absorber laminates, and laminated structures for near-infrared absorption, containing tungsten oxides or composite tungsten oxides according to the conventional art. Also, a near-infrared absorbing material fine particle dispersion in which composite tungsten oxide fine particles, each particle containing a hexagonal crystal structure, and a polymer compound with maleic anhydride introduced therein are contained in the polypropylene resin, and the near-infrared absorber laminate and the laminated structure for near-infrared absorption using the dispersion.

Near-infrared absorbing material fine particle dispersion, near-infrared absorber, near-infrared absorber laminate, and laminated structure for near-infrared absorption

A heat ray shielding film is disclosed, including composite tungsten oxide particles; and an ionomer resin. The composite tungsten oxide particles are expressed by a general formula MWO(where M denotes one or more kinds of elements selected from Cs, Rb, K, Tl, In, Ba, Li, Ca, Sr, Fe, Sn, Al, Cu, and Na, and 0.1&#x2264;x&#x2264;0.5 and 2.2&#x2264;y&#x2264;3.0).

Heat ray shielding film, heat ray shielding laminated transparent base material, vehicle, and building

A general-purpose composite tungsten oxide ultrafine particles capable of producing a dispersion liquid with high productivity while having properties such as good visible light transmittance and shielding light in a near-infrared region, and a composite tungsten oxide ultrafine particle dispersion liquid using the same, wherein a value of an XRD peak top intensity ratio of the composite tungsten oxide ultrafine particles is 0.13 or more when the XRD peak intensity is set to 1, with plane of a silicon powder standard sample (640 c produced by NIST) as a reference.

Composite tungsten oxide ultrafine particles and dispersion liquid of the same

There is provided a heat-ray shielding film including composite tungsten oxide particles; a thermoplastic resin; and a metal coupling agent, wherein the composite tungsten oxide particles are represented by a general formula MWO, where M is one or more elements selected from Cs, Rb, K, Tl, In, Ba, Li, Ca, Sr, Fe, Sn, Al, Cu, and Na, 0.1&#x2264;x&#x2264;0.5, and 2.2&#x2264;y&#x2264;3.0.

Heat-ray shielding film, heat-ray shielding laminated transparent substrate, automobile, building, dispersoid, mixed composition, method for manufacturing dispersoid, dispersion liquid, and method for manufacturing dispersion liquid

A near-infrared shielding material fine particle dispersion body, a near-infrared shielding body, and a near-infrared shielding laminated structure containing composite tungsten oxide that exhibits more excellent near-infrared shielding function than that of a conventional near-infrared shielding material fine particle dispersion body, near-infrared shielding body, and near-infrared shielding laminated structure, and a method for producing the same. Also, a near-infrared shielding material fine particle dispersion body in which near-infrared shielding material fine particles are dispersed in a solid medium. The near-infrared shielding material fine particles are composite tungsten oxide fine particles containing a hexagonal crystal structure, in which a lattice constant of the composite tungsten oxide fine particles is 7.3850 &#x212b; or more and 7.4186 &#x212b; or less on the a-axis, and 7.5600 &#x212b; or more and 7.6240 &#x212b; or less on the c-axis, and a particle size of the near-infrared shielding material fine particles is 100 nm or less.

Near-infrared shielding material fine particle dispersion body, near-infrared shielding body and near-infrared shielding laminated structure, and method for producing the same

Near-infrared shielding material fine particles that exhibit an effect of maintaining a high transmittance in a visible light region while shielding a light in a near-infrared region more efficiently than tungsten oxide and composite tungsten oxide of a conventional technique, and the method for producing the same, and a dispersion liquid containing the near-infrared shielding material fine particles. The near-infrared shielding material fine particles are composite tungsten oxide containing a hexagonal crystal structure, and a lattice constant of the composite tungsten oxide fine particles is 7.3850 &#x212b; or more and 7.4186 &#x212b; or less on the a-axis, and 7.5600 &#x212b; or more and 7.6240 &#x212b; or less on the c-axis, and a particle size of the near-infrared shielding material fine particles is 100 nm or less.

Near-infrared shielding material fine particles and method for producing the same, and near-infrared shielding material fine particle dispersion liquid

A heat ray-shielding film has excellent heat-shielding performance and a color tone, and exhibits weather resistance. A heat ray-shielding laminated transparent base material and a heat ray-shielding resin sheet material use the heat ray-shielding film. The heat ray-shielding film and the heat ray-shielding resin sheet material are expressed by a general formula MWO, and contain a composite tungsten oxide particle having a hexagonal crystal structure, selected wavelength absorbing material, and thermoplastic resin. The selected wavelength absorbing material has a transmission profile in which a transmittance of a light of a wavelength of 420 nm can be set to 40% or less when a transmittance of a light of a wavelength of 550 nm is 90% or more, and a transmittance of a light of a wavelength of 460 nm is 90% or more.

Heat ray-shielding film, heat ray-shielding laminated transparent base material, heat ray-shielding resin sheet material, automobile and building

Methods for producing a substrate for semiconductor element mounts are provided. A base substrate can be prepared having on a first metal layer, a second metal layer through which a metal layer for instrumentation is hardly diffusible. A patterned resist mask layer on the second metal layer can be formed. A surface of the second metal layer under reprocessing treatment can form a reprocessed surface which can be provided with an organic film that controls adhesion between the metal layer for instrumentation and the reprocessed surface by a liquid agent containing a component that shows the nature of amphoteric surfactant. The metal layer for instrumentation can be formed on the reprocessed surface via the organic film. A semiconductor element mount portion and an electrode terminal portion can be electroformed on the metal layer for instrumentation. The resist mask from the second metal layer of the base substrate may be removed.

Growing community of inventors

Isa, Japan

Hiroki Nakayama