Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Hitachi Astemo Ltd.

Hitachi High-tech Corporation

Hiroki Nakatsuchi

Tsutomu Kono

Ryotaro Shimada

Shinobu Tashiro

Keiji Suzuki

Mitsuru Onoda

Yasuaki Kageyama

Kazuo Goto

Keiji Hanzawa

Noboru Tokuyasu

Takahiro Sato

Takayuki Yogo

Kenji Ikeda

Yasuo Onose

Hiroaki Kojima

Tsubasa Watanabe

Masafumi Miyake

Tetsuyoshi Ono

Hisashi Morooka

Ukyo Ikeda

An electrode formed by molding a semiconductor device with resin. The electrode comprises: a first resin mold portion formed on a front surface of the semiconductor device and having a first thickness (t); a second resin mold portion formed on a back surface of the semiconductor device and having a second thickness (t) greater than the first thickness; and an exposed portion formed in a part of the first resin mold portion corresponding to an end of the semiconductor device.

Electrode structure

A flow-rate sensor is provided with a lead frame, a semiconductor chip that is disposed on one surface of the lead frame, and in which a diaphragm including a void portion on the lead frame side is formed, a flow rate detecting unit that is formed on the one surface including the diaphragm of the semiconductor chip, and resin that includes a flow passage opening portion exposing at least a portion of the flow rate detecting unit formed on the diaphragm, and covers the lead frame and the semiconductor chip. A lower side resin portion of the resin covering another surface side of the lead frame, on an opposite side to the one surface side thereof, has a thinned portion that is thinner than a periphery thereof in a region facing a peripheral edge portion of the diaphragm.

Flow-rate sensor

A flow meter includes: a flat substrate; a housing that houses the substrate and has an open in at least one surface; a cover that covers the substrate and covers an open surface of the housing; a support that supports the substrate and is in contact with the cover and the substrate; and a fixing unit that connects the substrate and the housing, in which, in a first region and a second region formed by dividing the substrate into two parts at a center in a longitudinal direction, the support is disposed in the first region, and the fixing unit is disposed in the second region.

Flow meter

Provided is a flow analysis method capable of predicting a flow state of a composite resin material by taking into account a change in filler dispersion degree of the composite resin material. In a flow analysis method for a composite resin material having a filler and a resin, in a certain process of identifying a region in which the composite resin material flows and analyzing a flow, an exothermic reaction speed of the composite resin material in the region is computed using a filler dispersion degree in the composite resin material, a temperature and the filler dispersion degree of the composite resin material in the region is computed using the computed exothermic reaction speed, and an exothermic reaction speed in a process subsequent to a process is computed using the computed filler dispersion degree.

Flow analysis method

When an exposed part of a semiconductor chip is reduced in size, a tendency of development of a crack on the semiconductor chip is suppressed. A pressure of injection of a resin MR into a second space creates a gap on a contact part SEL where an elastic film LAF and a semiconductor chip CHPare in contact, and a resin MRdifferent in constituent from the resin MR infiltrates into the gap. As a result, in an area of semiconductor chip CHPthat is exposed from the resin MR, the resin MRis formed in an area other than a flow detecting unit FDU and an area around it. Hence, an area of semiconductor chip CHPthat is exposed from the resins MR and MRcan be reduced in size.

Flow sensor and manufacturing method for the same

The present invention provides a method for analyzing growth of void of resin in a porous material which comprising the steps of inputting data of the shape of a porous material filled with a resin material, and dividing the shape of the porous material into three-dimensional solid elements; inputting physical properties of the porous material, and boundary conditions including a pressure that is applied to the porous material; obtaining a resin-density distribution in the porous material through fluid analysis using a database obtained by experimentally measuring in advance a temporal change in a volume of gas generated from the resin material and porous material during heating, changes in a compressive force and compressive displacement respectively occurring when the porous material impregnated with the resin is compressed, and a change in a flow resistance of the resin; and comprehensively grasping production, growth, and distribution of voids deriving from gas generation.

Method for analyzing growth of void of resin in a porous material

The present method aims at preventing breakdown by selecting conditions for preventing the occurrence of voids via analysis. According to the present method, a database related to the time variation of amount of generated gas or number of moles when a solid member is heated is experimentally formulated in advance, and the amount of generated gas from the member and the specific heat ratio of gases are entered for analysis in order to predict via analysis the generation of voids within the resin material when the solid member is heated, to thereby select conditions for preventing voids.

Method for predicting volume change of void generated in resin filled in porous body, and method for analyzing flow of resin material in porous body

Growing community of inventors

Tokyo, Japan

Hiroki Nakatsuchi