Sumitomo Chemical Company, Limited

Diamond Electric Mfg. Co., Ltd.

Diamond&zebra Electric Mfg.co., Ltd.

Hiroki Nakata

Tatsuya Ooue

Masashi Aoshima

Tatsuhiro Nagamatsu

Takanori Kume

Mitsuhiko Sato

Tadashi Sakurai

Yuuki Ookado

Electronic equipment includes a plurality of heat generating elements, a single heat sink, and a single cover. The heat generating elements are arranged adjacent to one another in a one-dimensional array in a predetermined alignment direction. The faces of the heat generating elements on one side are fixed directly or indirectly to the heat sink. The faces of the heat generating elements on the other side are in direct or indirect contact with the cover. The cover is fixedly screwed to the heat sink at opposite ends in the alignment direction on the outer side of the heat generating elements. The heat generating elements are sandwiched and held between the heat sink and the cover. This allows heat generated by the heat generating elements to be efficiently radiated via the heat sink and allows the heat generating elements to be easily connected to the heat sink.

Electronic equipment and electronic control device

An electronic device includes a housing, a circuit substrate, a connector, and a seal obtained by a sealant having fluidity being hardened. The housing includes a lower case and an upper case that covers the lower case. The connector is disposed between the upper case and the lower case. The lower case has a case groove. A connector projection disposed on the connector and a case projection disposed on the upper case are fitted into the case groove. The connector includes a connector groove, and the case projection is fitted into the connector groove. An obstructor for inhibiting flow of the sealant is disposed in the case groove or the connector groove.

Electronic device

Provided are a resin composition improved in utilization of active compound by controlling the bleeding of the active compound low in vaporizability and a molded product obtained from the resin composition. The resin composition comprises 100 parts by weight of a resin, 0.01-200 parts by weight of an active compound and 0.1-100 parts by weight of a vaporizable plasticizer having a vapor pressure of 0.001 mmHg or higher at 20.degree. C., and the vapor pressure (P1) of the vaporizable plasticizer at 20.degree. C. and the vapor pressure (P2) of the active compound at 20.degree. C. satisfy the formula: P1/P2.gtoreq.2.

Resin composition having active compound and vaporizable plasticizer,

The present invention provides a vulcanized rubber for a heat resistant vibration-isolator which can be obtained by vulcanizing a composition comprising:

Growing community of inventors

Osaka, Japan

Hiroki Nakata