Nichia Corporation

Hiroki Nakai

Kensuke Yamaoka

A method of manufacturing a light emitting device includes: mounting a light emitting element on a substrate; disposing a light shielding frame on a sheet, the light shielding frame having an opening; disposing a plate-shaped light transmissive member in the opening, the plate-shaped light transmissive member having a first face and a second face opposite the first face, wherein an outer perimeter of the first face is smaller than an inner perimeter of the opening; forming a light guide support member by filling the space with a first light reflecting member; bonding the light guide support member by bonding an upper face of the light emitting element and the second face of the light transmissive member; and forming a second light reflecting member surrounding the light emitting element by filling the space between the substrate and the light shielding frame with a second reflecting resin.

Method of manufacturing light emitting device

A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view, and at least two of the first external connecting parts being arranged between at least one set of adjacent ones of the exposed parts in the plan view. The second external connecting part is connected to the second electrode.

Light emitting element and light emitting device

A light emitting device includes a substrate, a light emitting element, and a frame. The substrate has a base and a wiring component. The frame surrounds the light emitting element on the substrate and has an inner edge and an outer edge. The wiring component has a first wiring layer constituting at least a part of an outermost surface of the wiring component inside of the outer edge of the frame, and connected to the light emitting element, and a second wiring layer constituting at least a part of the outermost surface of the wiring component outside of the inner edge of the frame, and made from a different material from the first wiring layer. A boundary between the first wiring layer and the second wiring layer on the outermost surface of the wiring component is disposed inside the outer edge of the frame.

Light emitting device

A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face that is larger than the upper face, disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light transmissive member; and a light shielding frame covering lateral faces of the light transmissive member via the light reflecting member. The light shielding frame has an opening. An outer perimeter of the lower face of the light transmissive member is positioned outward of an inner perimeter of the opening in a plan view as seen from above.

Light emitting device and method of manufacturing same

A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light emitting element and lateral faces of the light transmissive member; and a light shielding frame disposed on the upper face of the light reflecting member surrounding the light transmissive member. The light shielding frame has an opening, an inner perimeter of the opening is positioned at a distance apart from an outer perimeter of the upper face of the light transmissive member in a plan view as seen from above, and the light reflecting member is interposed between the inner perimeter of the opening and the outer perimeter of the upper face of the light transmissive member.

A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view. A group comprising at least one of the first external connecting parts and other group comprising at least one of the first external connecting parts respectively surround adjacent ones of the exposed parts while being spaced apart from each other in the plan view.

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Anan, Japan

Hiroki Nakai