Sharp Kabushiki Kaisha Corporation

Hiroki Nakahama

Takashi Matsui

Motoji Shiota

Yukio Shimizu

Keiji Aota

Takatoshi Kira

Hiroki Miyazaki

Gen Nagaoka

Seiji Muraoka

Makoto Tamaki

Hiroki Makino

Keigo Aoki

Minoru Horino

A display moduleof the present invention includes a first board, a second board, a base film, and a circuit member. The first boardand the second boardare bonded together to face with each other. The base filmis provided between the first boardand the second boardand extends outwardly from an end of the first board. The base filmhas an insulating property and the extended portion is bent to an outer surface side of one of the first boardand the second board. The circuit memberis formed on the base film

Display module and display device

A wiring substrate () includes: a substrate; and, formed upon the substrate, a plurality of wiring lines, a plurality of circuit elements, and a plurality of connecting terminals () connected via the plurality of wiring lines. Each of the plurality of connecting terminals () includes a pair of protrusion parts (), forming a depression part () between the pair of protrusion parts (), and a depression electrode () that is disposed in the depression part () and that at least partially covers each protrusion of the pair of protrusion parts ().

Electronic circuit substrate, display device, and wiring substrate

A drive IC chip () including a circuit for driving a display region () is mounted on a panel substrate (). An anisotropic conductive film () is interposed between the panel substrate () and the drive IC chip () and electrically connects the bump electrodes () of the drive IC chip () and the electrode pads () of the panel substrate (). The anisotropic conductive film () is arranged to extend beyond all side surfaces (to) other than one specific side surface () of the drive IC chip ().

Display panel and display device including the same

Provided is a wiring board wherein a circuit is not short-circuited when a IC chip is mounted on the wiring board. A wiring board () is provided with a substrate (); wiring layers (-), which are formed on a surface of the substrate () and have prescribed wiring patterns; connecting terminals (-), which are formed on a part of the wiring layers (-) and electrically connected with bumps (-) of an integrated circuit chip (IC chip) (); a mounting region (), which is arranged on the surface of the substrate () and has the integrated circuit chip () mounted therein; and an insulating layer (), which is formed on the surface of the substrate () so as to surround the circumference of the mounting region () for protecting wiring layers (-). A part of the insulating layer () is arranged inside the mounting region (), and the thickness of the insulating layer () is more than that of the bumps (-) of the integrated circuit chip ().

Wiring board and semiconductor device using the wiring board

Growing community of inventors

Osaka, Japan

Hiroki Nakahama