Namics Corporation

Hiroki Myodo

Masaaki Hoshiyama

Toyokazu Hotchi

Yosuke Sakai

There are provided a syringe filled with a resin composition and a storage method thereof. According to the syringe and the storage method, mixed air, which causes the resin composition to be intermittently discharged from the syringe, is suppressed. The syringe filled with the resin composition includes a syringe, a resin composition filling the syringe, and a plunger. The resin composition contains voids. The ratio of the volume of the voids relative to the volume of the resin composition is 1.0 ppm by volume to 520 ppm by volume. The voids have a maximum diameter of 2,500 μm or less.

Syringe filled with resin composition and storage method therefor

There is provided a syringe filled with a resin composition which prevents a barrel cap from being detached due to temperature change during storage or during transportation, a production method thereof, and a storage method thereof. This syringe filled with the resin composition includes a syringe having a syringe barrel, a resin composition filling the syringe barrel, a plunger inserted in the syringe barrel, a barrel cap blocking an opening of the syringe barrel, and a spatial part between the plunger and the barrel cap in the syringe barrel. The pressure of the spatial part in a frozen state is 50 kPa to 92 kPa.

Resin composition-filled syringe, and production method and preservation method for same

An object of the present invention is to provide a semiconductor device in which peeling between a mold resin and a substrate is suppressed. A semiconductor deviceincludes a semiconductor chipand a substratethat are molded with a mold resin layerThe semiconductor deviceincludes a resin layerhaving a thickness of 200 nm or less different from the mold resin layerbetween the cured mold resin layerand the substrateThe resin layerpresent between the mold resin layerand the substrateis preferably present on a periphery of 30% or more of the chip when an entire peripheral length of the chip is 100%.

Semiconductor device

An object of the present invention is to provide a resin composition in which voids are suppressed during application, the voids and delamination are suppressed after reflow subsequent to mounting and a moisture absorption resistance test, and the delamination and change in resistance value after curing are suppressed, when used in a pre-supply type process. Provided is the resin composition containing (A) an acrylate compound or methacrylate compound having a specific structure and not having an aliphatic cyclic structure, (B) an acrylate compound or a methacrylate compound having an aliphatic cyclic structure and not having a structure of Chemical Formula (1), (C) an acid anhydride-modified polybutadiene compound, (D) silica particles, and (E) a polymerization initiator.

Growing community of inventors

Niigata, Japan

Hiroki Myodo