Sharp Kabushiki Kaisha Corporation

Hiroki Miyazaki

Takashi Matsui

Motoji Shiota

Gen Nagaoka

Masaki Nakayama

Seiji Muraoka

Yasuhiko Tanaka

Yasuhiro Hida

Keiji Aota

Takatoshi Kira

Yukio Shimizu

Hiroki Nakahama

Makoto Tamaki

Hiroki Makino

Minoru Horino

In order to inhibit defective connection between a bump of a semiconductor chip and an electrode pad of a substrate, a semiconductor device includes a substrate provided on a surface with a plurality of electrode pads, a semiconductor chipprovided on a surface with a plurality of bumpssubstantially equal in size, and an anisotropic conductive filminterposed between the plurality of bumpsand the plurality of electrode padsand electrically connecting each of the bumpsand corresponding one of the electrode pads. The plurality of electrode padsincludes a plurality of first electrode padsA positioned closest to an endof the semiconductor chip, and a plurality of second electrode padsB positioned inside the plurality of first electrode padsA on the semiconductor chip. Each of the second electrode padsB is larger in area than each of the first electrode padsA.

Semiconductor device

An array circuit boardB includes a glass substrate, an IC chip, two ACFs, and a resin film. The IC chipis disposed on the glass substrate. The ACFsare disposed between the glass substrate and the IC chipfor electrically connecting the glass substrate and the IC chiptogether. The ACFsare separated from each other. The resin filmis made of resin material having cure shrinkage smaller than the ACFsand disposed to fill a gap between the ACFsadjacent to each other between the glass substrate and the IC chip

Circuit board, display panel, and display device

A display apparatus is provided with: a frame; a display panel, which is fixed to the frame; and a plurality of flexible printed circuit boards, which are disposed adjacent to each other, and each of which has one end side pressure bonded to the display panel, and the other end side bent to the frame side, which is the reverse side of the display panel. The display apparatus has adhesive areas wherein a surface of the display panel is adhered and fixed to the frame, the adhesive areas being in areas overlapping the flexible printed circuit boards. In regions among the flexible printed circuit boards adjacent to each other, non-adhesive areas where the surface of the display panel is not adhered and fixed to the frame are provided.

Display apparatus

A display moduleof the present invention includes a first board, a second board, a base film, and a circuit member. The first boardand the second boardare bonded together to face with each other. The base filmis provided between the first boardand the second boardand extends outwardly from an end of the first board. The base filmhas an insulating property and the extended portion is bent to an outer surface side of one of the first boardand the second board. The circuit memberis formed on the base film

Display module and display device

Provided is a circuit board in which visibility of an alignment mark is improved. In a case of manufacturing a substrate module in which a touch panel () and an FPC () are electrically connected, an alignment mark in the FPC () is formed by an opaque metal film, so that visibility is high. Consequently, when an alignment mark () in the touch panel () is also formed by an opaque metal film, the visibility of the alignment mark () also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel () and the FPC () can be performed easily with high precision. As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.

Circuit board, substrate module, and display device

Affixed to a projection () of a glass substrate () included in a liquid crystal module () are a first ACF (), which has low surface tack strength but high connection reliability, and a second ACF (), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (), electronic components (), etc., are mounted on the glass substrate (), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.

Board module and fabrication method thereof

Provided are a chip component mounting structure and a chip component mounting method, wherein when a plurality of chip components having different heights are mounted on a substrate via an anisotropic conductive film, position gaps which occur when the chip components are pressure-bonded to the substrate are prevented, and the chip components can be accurately mounted to the substrate at target positions; and a liquid crystal display device provided with the substrate. In the chip component mounting structure, a position fixing resin () for maintaining the orientation of chip components () which are pressure-bonded to a substrate () via an anisotropic conductive film () is provided. In the chip component mounting method, after the position fixing resin () for maintaining the orientation of the chip components () which are mounted to the substrate () via the anisotropic conductive film () is applied to the substrate () and cured, the chip components () are heated at a predetermined temperature and pressed at a predetermined pressure via an elastic sheet () provided on the chip components () and, then, pressure-bond to the substrate () together. The liquid crystal display is provided with such a substrate.

Growing community of inventors

Osaka, Japan

Hiroki Miyazaki