Denso Corporation

Hiroki Matsuzawa

Bahman Hossini Soltani

Kazuya Takeuchi

To provide a semiconductor device capable of effectively releasing heat from a semiconductor element, the semiconductor device includes a semiconductor element, a heat sink connected thermally to the semiconductor element and a coolant flow channel formed facing the heat sink. The heat sink is integrally composed of multiple cooling fins projecting toward the coolant flow channel. A linear base of each of the multiple cooling fins inclines relative to a direction in which a coolant is supplied through the coolant flow channel. An inclination of a linear base of each of the cooling fins arranged adjacent to each other in the direction relative to the coolant flow direction is substantially opposite from each other.

Semiconductor device

A power conversion apparatus includes a semiconductor element, a plurality of lead frames, a flow-passage formation body, an insulating portion, a metal joining material, and a resin sealing portion. The plurality of lead frames are electrically connected to the semiconductor element. The flow-passage formation body forms a coolant flow passage in which a coolant flows. The insulating portion is arranged between the lead frame and the flow-passage formation body to provide insulation between the lead frame and the flow-passage formation body. The metal joining material joins the insulating portion and the flow-passage formation body. The resin sealing portion seals the semiconductor element and the lead frames. The semiconductor element and the lead frames are integrated with the flow-passage formation body to form a semiconductor cooling assembly by the resin sealing portion.

Plurality of cooling tubes with coolant for a power conversion package

A connector installed in a casing containing an electronic device such as a car navigation device is coupled to another connector installed in a memory device such as a hard disc. The connector includes a support member composed of a back plate and side plates connected to the back plate. The connector is disposed on the back plate, and coupling guides to be coupled to guiding grooves formed on the memory device are formed integrally with the side plates. The coupling guides are slid into the guiding grooves to correctly position the connector relative to the memory-side connector when the memory device is coupled to the casing containing the connector. Thus, the connector is surely coupled to the memory-side connector at a right position to establish electrical connection between two connectors.

Growing community of inventors

Kariya, Japan

Hiroki Matsuzawa