Tokyo Ohka Kogyo Co., Ltd.

Elco Corporation

Tokyo Okha Kogyo Co., Ltd.

Hiroki Maeda

Toru Takahashi

Naoya Katsumata

Atsushi Yamanouchi

Masami Yanai

A photosensitive laminate film for forming a top plate portion, which is suitably used for efficiently and inexpensively forming various precision fine spaces, particularly the precision fine spaces formed in an electronic part such as inkjet head, and a method of forming the precision fine space using the photosensitive laminate film are provided. As the photosensitive laminate film for forming the top plate portion of the precision fine space, which constitutes the top plate portion of the precision fine space by being placed on the precision minute concave portion so as to cover an upper opening followed by being cured, a laminate film providing at least the photosensitive composition layer and the transparent support film is used. The transparent support film supports the photosensitive composition layer as well as prevents the photosensitive composition layer from being deformed upon curing.

Photosensitive laminate film for forming top plate portion of precision fine space and method of forming precision fine space

There is provided a photosensitive thermosetting resin composition used for producing a permanent film, capable of forming a resin layer which is excellent in fluidity upon heat bonding after pattern, formation and also has excellent adhesion as well as bonding properties and/or sealing properties. This composition contains a reaction product of (A) an alkali soluble resin and (C) a 10 crosslinking polyvinyl ether compound, (B) a compound generating an acid under irradiation with radiation, and (D) an epoxy resin.

Chemically amplified positive photosensitive thermosetting resin composition, method of forming cured article, and method of producing functional device

A method for connecting the wires of a high density, flat transmission cable to a connector is provided. A crimp connector for facilitating the practice of the method is also provided. The connector includes one or more rows of contacts mounted thereto. Each contact includes a crimp section extending from the connector housing. The crimp sections are plated with a relatively thick layer of solder. After stripping the end of the cable, selected cable conductors are inserted within the crimp sections. A batch crimping operation secures the conductors to the contacts, after which the crimp sections are heated to fuse the solder. Once the solder has cooled, a reliable connection will be established between the cable and connector. A solder-plated bus bar may also be secured to selected cable conductors by preliminarily mounting the conductors thereto and then heating the bus bar.

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Kanagawa, Japan

Hiroki Maeda