Fuji Electric Co., Ltd.

Hiroki Kogawa

Tadahiko Sato

Takashi Katsuki

Takahiro Nishijima

A semiconductor device, including an insulated circuit board that has a radiation plate, a resin board adhered to a front surface of the radiation plate, and a circuit pattern adhered to a front surface of the resin board. The resin board contains a resin. The semiconductor device further includes a wiring member, and at least one semiconductor chip, bonded to the front surface of the circuit pattern or electrically connected to the wiring member. The circuit pattern has at least one pair of side portions opposite to each other that are supported by the resin board.

Semiconductor device and semiconductor device manufacturing method

A semiconductor package is provided, including: a package body; and a plurality of lead terminals exposed from each of at least three side surfaces of the package body, wherein the plurality of lead terminals include: a plurality of lead terminals exposed from a first side surface, half or more of which have tips pointing in a direction along the first side surface; a plurality of lead terminals exposed from a second side surface, all of which have tips pointing in a direction along a direction orthogonal to the second side surface; and a plurality of lead terminals exposed from a third side surface, half or more of which have tips pointing in a direction along the third side surface, or all of which have tips pointing in a direction along a direction orthogonal to the third side surface.

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Matsumoto, Japan

Hiroki Kogawa