Murata Manufacturing Co., Ltd.

Hiroki Kitayama

Kiyoshi Kurihara

Akio Katsube

Hideo Nakagoshi

Shinji Otani

Muneyuki Daidai

Koji Murata

Masahiro Saito

Shigehisa Yago

Koji Nagahara

Atsushi Sugimasa

A piezoelectric vibration component that includes a piezoelectric vibrator, a substrate, and a conductive adhesive that bonds the piezoelectric vibrator to the substrate. The conductive adhesive contains a silicone-based base resin, a cross-linker, a conductive filler, and an insulating filler. The silicone-based base resin has a weight-average molecular weight of 20,000 to 102,000. The cross-linker has a number-average molecular weight of 1,950 to 4,620. The conductive filler and the insulating filler have a particle size of 10 &#x3bc;m or less.

Piezoelectric vibration component and application method

A solid electrolytic capacitor that includes a capacitor element; an exterior resin; an anode lead terminal; and a cathode lead terminal. The anode lead terminal has a Cu base material, and an Au-plating layer formed thereon, and includes an Au region where the Au-plating layer as a surface layer is formed, and a Cu region where the Au-plating layer is not formed. The cathode lead terminal includes a base material, and an Au-plating layer as a surface layer of the cathode lead terminal, which is formed on the base material, and an anode section of the capacitor element is connected to the Cu region of the anode lead terminal.

Solid electrolytic capacitor, electronic component module, method for producing solid electrolytic capacitor and method for producing electronic component module

A bonding method that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 &#x3bc;m to about 50 &#x3bc;m. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive.

Bonding method for bonding metal plate and piezoelectric body

In a solid electrolytic capacitor, resistance welding is carried out to bond a valve metal substrate and a spacer together while controlling a welding current so that only a bonding material provided in spacers and having a relatively low melting point is melted. At least a portion of the bonding material provided in the spacer penetrates an etching part of the valve metal substrate, and thickness Ta of a core part located at a positive electrode part in the valve metal substrate and thickness Tc of the core part located at a negative electrode part satisfy the requirement of |Tc&#x2212;Ta|/Tc&#xd7;100&#x2266;10[%].

Solid electrolyte capacitor and method for manufacturing the same

A bonding structure that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 &#x3bc;m to about 50 &#x3bc;m. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive.

Growing community of inventors

Nagaokakyo, Japan

Hiroki Kitayama