Kitagawa Industries Co., Inc.

Shinshu University

National Institute of Advanced Industrial Science and Technology

Hiroki Kitano

Hideo Yumi

Tatsuya Nakamura

Akio Yamaguchi

Tomohisa Kurita

Morinobu Endo

Kenji Konda

Josue Ortiz Medina

Kimihiro Ozaki

Yasuhiro Kawaguchi

Kenta Takagi

A reverse osmosis membrane of the present invention includes a porous support substrate () and a separation active layer () formed on a surface of the porous support substrate () and formed of a carbon film containing organized carbon.

Reverse osmosis membrane and method for producing reverse osmosis membrane

A method of forming a reverse osmosis membraneof the present invention includes a coating membrane forming step of forming a coating membrane which is soluble in a predetermined solvent on a surface of a porous support substratethat is insoluble in the solvent, a carbon membrane forming step of forming a carbon membraneon the coating membrane by a physical vapor deposition which deposits carbon as a target material under an atmosphere where rare gas and nitrogen gas are contained, and a removing-by-dissolving step of removing the coating membrane by dissolving the same in the solvent after formation of the carbon membrane

Method of forming reverse osmosis membrane

In a thermoelectric conversion module, each of a p-type element and an n-type element is configured by aligning a plurality of particles in series and connecting the particles to each other. Around a connection part in which the particles are connected to each other, a protrusion is protruded. The protrusion has a shape of continuously extending around the entire periphery of the connection part. The protrusion may be partly interrupted, but in such a case, a circumferential length of one interrupted portion is less than one half of the periphery of the connection part.

Thermoelectric conversion element, manufacturing method for the thermoelectric conversion element, and thermoelectric conversion module

A conductive member includes a metal part and an elastomer part. The conductive member is configured such that, when the conductive member is interposed between a first member and a second member, the elastomer part is elastically deformed so that a top end portion of at least one upper surface-side convex part in the metal part is pressed toward a side of the second member, and a top end portion of at least one under surface-side convex part in the metal part is pressed toward a side of the first member.

Conductive member and method for producing same

A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board. A pair of support parts are connected to the solder joint part and, when the solder joint part is soldered and connected to the printed circuit board, are supported in a position above the printed circuit board at an interval between the pair of support parts. The interval allows a conductive member, other than the printed circuit board, to be inserted therein. A resilient contact part, that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.

Surface mount clip

A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.

Contact and bonding structure of the contact

A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.

Growing community of inventors

Kasugai, Japan

Hiroki Kitano