Mitsubishi Electric Corporation

Hiroki Katsube

Masakazu Tani

Shota Yamabe

Takuya Nakamura

Masaki Taya

This power conversion device includes: a power module unit; and a capacitor module including a capacitor element, and a capacitor busbar. The capacitor busbar has a flat-plate portion, a plurality of power terminal connection portions, a power supply connection portion, and a plurality of element connection portions. An element-connection-portion position range which is a position range in a first direction between two element connection portions located at both ends, and a power-terminal-connection-portion position range which is a position range in the first direction between two power terminal connection portions located at both ends, are within a position range in the first direction where the flat-plate portion is located. A length of the element-connection-portion position range and a length of the power-terminal-connection-portion position range are equivalent to each other. A center position of the element-connection-portion position range and a center position of the power-terminal-connection-portion position range are equivalent to each other.

Power conversion device

An object is to provide a power conversion device that enables a capacitor element to be efficiently cooled, thus suppressing deterioration of the capacitor element due to heat. The power conversion device includes: a power module including a module body portion storing a semiconductor element, and a power terminal protruding from the module body portion; a capacitor module including a capacitor body portion storing a capacitor element, and a capacitor busbar protruding from the capacitor body portion and connected to the power terminal; and a housing storing the power module and the capacitor module. The housing has a first surface to which the power module is thermally connected, and a second surface to which the capacitor module is thermally connected. A coolant path for cooling the first surface is provided on a back side of the first surface. The capacitor busbar is thermally connected to the first surface.

This semiconductor device includes: a heat dissipation plate formed in a plate shape; a plurality of switching elements joined to one surface of the heat dissipation plate; a first terminal extending in a direction away from the heat dissipation plate in a state of being apart from the heat dissipation plate, the first terminal being connected via a first electric conductor to surfaces of the plurality of switching elements on an opposite side to the heat dissipation plate side; and a sealing member sealing the plurality of switching elements, the heat dissipation plate, and the first terminal. A notch is provided in an outer periphery portion of the heat dissipation plate. A portion of the first terminal on the heat dissipation plate side overlaps with a region of a cut at the notch as seen in a direction perpendicular to the one surface of the heat dissipation plate.

Plurality of transistors attached to a heat sink with a periphery notch

An object herein is to provide a bus bar module which is highly reliable in insulation performance, by reducing stresses imposed on its spacer to thereby suppress deterioration in the insulation property thereof. The bus bar module includes: a bus bar having a hole in its parallel planar region and made of an electrically conductive material; a bus bar opposed to the bus bar, having a hole in its parallel planar region and at a position corresponding to the hole, and made of an electrically conductive material; a spacer made of an insulating material, which is sandwiched between the bus bars, and in which a hole is provided so as to overlap with the hole and the hole; and a resin mold covering these bus bars and the spacer; wherein a through-hole that is established by the holes, is filled with a portion of the resin mold.

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Tokyo, Japan

Hiroki Katsube