Sony Chemical & Information Device Corporation

Hiroki Kanaya

Junichi Ishii

Mamiko Nomura

Tomoyasu Sunaga

A novel polyimide resin is formed by imidizing a diamine component including an amide group-containing siloxane diamine compound represented by the following formula (1) and an acid dianhydride component including an aromatic acid dianhydride such as 3,3',4,4&#x2032;-diphenylsulfone tetracarboxylic dianhydride. This novel polyimide resin utilizes a novel polyimide resin into which a reaction group capable of reacting with a crosslinking agent to form a crosslinking point is pre-introduced before imidization. The novel polyimide resin can confer a comparatively low elastic modulus and heat resistance to a dry film or a photosensitive cover film formed from a photosensitive polyimide resin composition containing the novel polyimide resin. In the formula (1), Rand Rare each independently an optionally-substituted alkylene group, m denotes an integer of 1 to 30, and n denotes an integer of 0 to 20.

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Tochigi, Japan

Hiroki Kanaya