Denso Corporation

Nippon Soken, Inc.

Hiroki Kamiya

Satoshi Takeuchi

Motoki Shimizu

Masashi Hori

Toshihiro Miyake

Taku Iida

Takashi Kamiya

Yoshio Hironaka

Yasushi Matsumura

Masashi Hiramatsu

Atsushi Furumoto

Katsunori Kubota

Masato Kamino

Masayasu Yamamoto

Hisahiro Ikeda

A reflow device configured to perform reflow soldering on a substrate having a first component and a second component having a heat capacity larger than a heat capacity of the first component. The reflow device includes a plurality of heating sections applying gas to the substrate, a booth accommodating the heating sections, and a controller configured to perform, at least twice or more times, a heating control of controlling the heating sections to increase both of a temperature of the first component and a temperature of the second component, and then reduce the temperature of the first component while increasing the temperature of the second component.

Reflow device and method for manufacturing substrate using the reflow device

A component-embedded board device has a wiring board in which an electronic component is embedded, a connection member which is conductive and arranged at a surface of the wiring board, and an inner wiring unit which is arranged in the wiring board and connects an electrode of the electronic component with the connection member. The component-embedded board device is further provided with an inspection connection member for an inspection of a faulty wiring of the inner wiring unit, and an inspection wiring unit which is arranged in the wiring board and connects the inspection connection member with one of the electrode and a predetermined portion of the inner wiring unit. The inspection connection member is conductive and arranged at a surface of the wiring board.

Component-embedded board device and faulty wiring detecting method for the same

A multilayer substrate includes an insulating base member having a plurality of resin films, an electric element embedded in the insulating base member, and a spacer. The resin films are made of a thermoplastic resin and stacked and attached to each other. At least one resin film has a through hole for inserting the electric element. The one resin film further has a plurality of protruding members. One protruding member opposes to another one protruding member so that the one and the another one contact and sandwich the electric element. The spacer is arranged between the one resin film and an adjacent resin film and is disposed at a base portion of one of the protruding members.

Multilayer substrate and method of manufacturing the same

A card edge connector includes a housing, a first conductive part, a second conductive part, a connecting element, a first harness, and a second harness. The housing has an insertion hole for receiving an electronic substrate therein. The first conductive part and the second conductive part are disposed in the insertion hole and are configured to come in contact with respective terminals disposed on a surface of the electronic substrate. The connecting element is coupled with the second conductive part and extends in a direction approximately vertical to a planer direction of the electronic substrate so as to be away from the surface of the electronic substrate. The first harness is coupled with the first conductive part and the second harness penetrates a penetrated part of the connecting element.

Card edge connector and method of manufacturing the same

A card edge connector includes a housing, a first conductive part, a second conductive part, a supporting conductive part, a connecting element, a first harness, and a second harness. The housing has an insertion hole for receiving an electronic substrate therein. The first conductive part and the second conductive part are disposed in the insertion hole and are configured to come in contact with respective terminals disposed on a surface of the electronic substrate. The supporting conductive part is disposed in the housing in such a manner that supporting conductive part is farther away from the surface of the electronic substrate than the first conductive part is. The connecting element couples the second conductive part and the supporting conductive part, the first harness is coupled with the first conductive part, and the second harness is coupled with the supporting conductive part.

Growing community of inventors

Nagoya, Japan

Hiroki Kamiya