Hamamatsu-photonics K.k.

Hiroki Kamei

Katsumi Shibayama

Masashi Ito

Yoshihiro Maruyama

Toru Hirohata

Kazuyoshi Hirose

Masaki Hirose

Takafumi Yokino

Takashi Kasahara

Hiroki Oyama

Toshimitsu Kawai

Kazuto Ofuji

Soh Uenoyama

Anna Yoshida

Takahiro Sugiyama

Akiyoshi Watanabe

A three-dimensional measurement device includes one or a plurality of light source units configured to irradiate the object to be measured SA with measurement light having a predetermined pattern, one or a plurality of image capture units configured to capture an image of the object to be measured which is irradiated with the measurement light, and a measurement unit configured to measure a three-dimensional shape of the object to be measured on the basis of results of image capture performed by the image capture units. The light source units are constituted by an S-iPMSEL of M-point oscillation.

Three-dimensional measurement device

A method for producing an optical element includes: forming a resist layer on a main surface of a substrate; forming a pattern region in the resist layer; forming a groove; forming a dielectric layer covering the pattern region; and forming an optical functional portion. The pattern region is formed in the resist layer. The groove is formed in a portion corresponding to a periphery of the pattern region as viewed in a direction orthogonal to the main surface. A dielectric is deposited to form the dielectric layer. After the dielectric layer covering the pattern region is formed, the resist layer is removed to form the optical functional portion at a position where the pattern region is disposed on the main surface. The optical functional portion is made of the dielectric.

Method for producing optical element and optical element

A method for producing an optical element includes: disposing a joint layer on a substrate; forming a first portion and a second portion in a second surface of the joint layer; and forming a plurality of structural bodies, which are made of a dielectric, on the second surface of the joint layer. The joint layer has a first surface facing the substrate, and the second surface located on a side opposite the first surface. The first portion is covered with a resist layer, and the second portion is exposed from the resist layer. After the dielectric is laminated on at least the second portion, the resist layer is removed to form the plurality of structural bodies on the second surface.

A SERS elementcomprises a substratehaving a front face; a fine structure part, formed on the front face, having a plurality of pillars; a first conductor layerformed on the front faceand fine structure partso as to cover the front faceand fine structure partcontinuously; and a second conductor layerformed on the first conductor layerso as to form a plurality of gaps G, Gfor surface-enhanced Raman scattering; while the first and second conductor layersare constituted by the same material.

Surface-enhanced Raman scattering element, and method for manufacturing surface-enhanced Raman scattering element

A SERS element comprises a substrate; a fine structure part formed on a front face of the substrate and having a plurality of pillars; and a conductor layer formed on the fine structure part and constituting an optical function part for generating surface-enhanced Raman scattering. The conductor layer has a base part formed along the front face of the substrate and a plurality of protrusions protruding from the base part at respective positions corresponding to the pillars. The base part and the protrusions form a plurality of gaps in the conductor layer, each of the gaps having an interstice gradually decreasing in the projecting direction of the pillar.

Surface-enhanced raman scattering element including a conductor layer having a base part and a plurality of protusions

A SERS element comprises a substrate; a fine structure part formed on a front face of the substrate and having a plurality of pillars; and a conductor layer formed on the fine structure part and constituting an optical function part for generating surface-enhanced Raman scattering. The conductor layer has a base part formed along the front face of the substrate and a plurality of protrusions protruding from the base part at respective positions corresponding to the pillars. The base part and the protrusions form a plurality of gaps in the conductor layer, each of the gaps having an interstice gradually decreasing in a direction perpendicular to the projecting direction of the pillar.

Surface-enhanced Raman scattering element including a conductor layer having a base part and a plurality of protusions

A SERS element comprises a substrate having a front face; a fine structure part formed on the front face and having a plurality of pillars; and a conductor layer formed on the fine structure part and constituting an optical function part for generating surface-enhanced Raman scattering. The conductor layer has a base part formed along the front face and a plurality of protrusions protruding from the base part at respective positions corresponding to the pillars. The base part has a thickness greater than the height of the pillars.

Surface-enhanced Raman scattering element, and method for producing same

A SERS element comprises a substrate having a front face; a fine structure part formed on the front face and having a plurality of pillars; and a conductor layer formed on the fine structure part and constituting an optical function part for generating surface-enhanced Raman scattering. The conductor layer has a base part formed along the front face and a plurality of protrusions protruding from the base part at respective positions corresponding to the pillars. The base part is formed with a plurality of grooves surrounding the respective pillars when seen in the projecting direction of the pillars, while an end part of the protrusion is located within the groove corresponding thereto.

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Hamamatsu, Japan

Hiroki Kamei