Rohm Co., Ltd.

Other

Hiroki Ishinaga

Takehiro Fujii

Hideki Matsubara

Toshihiko Takebe

Mamoru Maegawa

Tsutomu Sawabe

A light emission apparatus includes: an electrode; a LED mounted on the electrode with an indium layer interposed therebetween, the LED having a substrate formed of an n-type ZnSe single crystal, and an epitaxial light emission structure formed of a compound crystal comprising ZnSe serving as a matrix, the epitaxial light emission structure being provided on the substrate and emitting light when an electric current is introduced thereinto; and resin encapsulating the LED, the resin having a glass transition temperature of lower than 80 degrees centigrade or being soft to be still elastic in a vicinity of the LED at room temperature.

Light emission apparatus and method of fabricating the same

The present invention provide a light emitting device including: a resin base having a patterned interconnection; an n-type ZnSe substrate mounted on the resin base; an epitaxial light emission structure formed of a compound crystal relating to ZnSe serving as a matrix, formed on the ZnSe substrate and emitting light when an electric current is applied. A reflector is so constructed and positioned that a spatial distribution of the light emission intensity of the fluorescence light approximates the light emission intensity of the epitaxial light emission structure. The fluorescence light is produced in the ZnSe substrate excited by with the light emission from the epitaxial light emission structure.

Light emitting device

On a rectangle-shaped insulation substrate ( ) on which a pair of electrodes ( ) and ( ) are provided, a light emitting element chip ( ) having an n-side electrode ( ) and a p-side electrode ( ) connected to the pair of electrodes respectively is provided. Then, the periphery of the light emitting element chip is covered with the light transmitting member ( ), and a light reflection member ( ) covering at least a portion of the light transmitting member is provided so that light is radiated from a portion of the light transmitting member which is not covered and exposed. A light reflection member is provided in such a manner that the portion of the light transmitting member is not covered is exposed over from a one side (A) to at least a part of the side portions (B) and (C) on both sides connected to the side portion (A). As a consequence, the directivity is widened with the result that the dark is hardly generated between the light sources which can be used as backlight even when the light sources are arranged in a large interval.

Chip-type semiconductor light emitting device

A chip-type light-emitting device ( ) with case includes a chip ( ), and the chip is die-bonded onto an electrode ( ) formed on a substrate ( ). Furthermore, the light-emitting device includes a case ( ) having holes ( ) at an approximately center of respective lower portions on first side surfaces of the case, and steps ( ) formed on respective upper edges of second side surfaces. A transparent resin for sealing the chip is filled from the holes to be filled in the case . At this time, the transparent resin is flowed from bottom to top in the case, and an air is discharged from an air vent which includes the steps.

Light-emitting chip device with case and method of manufacture thereof

A chip-type light-emitting device with case ( ) includes an LED chip ( ) which is bonded onto electrodes ( ) formed on a substrate ( ). A case ( ) is arranged such that the LED chip is surrounded by a hole ( ). The hole has an inner wall ( ) tapering downward shaped like a frustum of a cone, in which transparent resin is filled as a sealant. When cured, the transparent resin hardens and shrinks, and therefore, a gap ( ) is formed between the inner wall and the transparent resin (sealant).

Chip-type light-emitting device with case

A chip light-emitting device includes a baseboard LED elements different in color of emission light are respectively mounted on two electrodes formed on a surface of the baseboard. A reflector has an aperture in an oval form as viewed in plan and placed on the baseboard such that the LED elements are at a center surrounded by a slant surface of an inner wall of the aperture. The slant surface includes two reflection surfaces continued almost at a center of the reflector with respect to a thickness direction. The reflection surfaces are set with respective inclination angles such that a first angle (&thgr;p), given between reflection light reflected on a lower side of the lower reflection surface and reflection light reflected on an upper side the lower reflection surface that are due to the first output light of the first LED element arranged closer to the lower reflection surface, equal to a second angle (&thgr;q), given between reflection light reflected on a lower side the upper reflection surface and reflection light reflected on an upper side of the upper reflection surface that are due to second output light from the second LED element arranged distant from the lower reflection surface.

Chip semiconductor light-emitting device

A chip-type semiconductor light-emitting device includes a substrate ( ). An LED element ( ) is mounted on a pad ( ) formed in one ( ) of a pair of electrodes ( ) formed on the substrate ( ). A reflector ( ) is formed with an aperture ( ) defined by a slant surface ( Z) and opened to the outside to accommodate therein the LED element ( ). Translucent resin is filled in the aperture ( ). The slant surface ( Z) has a plurality of reflection surfaces (P, Q) formed continuous thickness-wise of the reflector, which are selected in inclination angle relative to the substrate ( ) such that light is reflected to the immediate upward at respective mid-slopes of the reflection surfaces.

Light-emitting semiconductor chip

A backside light emitting chip type light emitting element having at least three internal electrodes and at least three external electrodes electrically connected to the internal electrodes respectively on one principal surface of an insulating substrate, and at least two light emitting chips connected to the internal electrodes. The light emitting chips may emit light of different colors, respectively.

Backside light emitting chip type light emitting element and insulating substrate therefor

A semiconductor device includes a substrate, a semiconductor chip for emitting light, and a reflector enclosing the semiconductor chip for reflecting the light emitted from the semiconductor chip. The substrate is provided with a first electrode and a second electrode each electrically connected with the semiconductor chip. A transverse cross-section of the reflector defines an elongated figure, such as oblong, elliptical, rhombic or rectangular.

Semiconductor device with reflector

A display device for performing a display by turning on selected ones of a plurality of light sources is disclosed. This display device comprises a substrate having an upper surface disposed with the light sources, a reflecting case mounted to the substrate and provided with a plurality of window holes each corresponding to one of the light sources, and a lower surface terminal portions each provided in a lower surface of the substrate and electrically connected to one of the light sources. The lower surface terminal portions are disposed in a region inward of outer edges of the substrate.

Display device and display device assembly

A chip type semiconductor light emitting device includes a semiconductor light emitting chip connected to a pair of electrodes formed on a substrate. The semiconductor light emitting chip is molded together with respective portions of the electrodes by a resin. The electrode has a layered structure having a Cu layer, an Ni layer and an Au layer in the order from the below. Disconnection is formed in the Au layer at a position inside the mold.

Chip type semiconductor light emitting device having a solder preventive portion

An LED chip component has a resin molding which can be firmly fixed to an insulating substrate even in a case where the exposed area of the insulating substrate cannot be increased any further. To achieve this object, according to a first embodiment, a resin molding is so formed as to flow into (i.e., reach the inside of) a through hole formed in an insulating substrate, and according to a second embodiment, a resin molding is so formed as to flow into two cuts formed respectively at two opposing side edges of an insulating substrate so that the resin molding holds the insulating substrate at two opposing side edges.

Light-emitting diode chip component and a light-emitting device

In a two-color LED chip component, the terminals are so arranged that side-surface light emission can be achieved simply by vertically mounting the insulating substrate. This LED chip component is produced by forming on the top surface of the insulating substrate three conductive patterns that extend up to one side surface of the substrate, fixing two LED elements of different colors with conductive paste onto the conductive pattern formed at the center, and connecting the LED elements individually to the other conductive patterns with wires. The central conductive pattern may be so formed as to reach the bottom surface through a through hole formed in the substrate so that it further extends to the side surface within the bottom surface.

A surface mounting type light emitting display device is provided which includes a base plate and a case member. The base plate is formed with terminal electrodes at least along one edge thereof and carries light emitting elements thereon. The case member is provided for covering and accommodating the light emitting elements. The display device further includes a mounting device for attaching the case member to the base plate while allowing the case member and the base member to expand and contract independently of each other at least in one direction.

Surface mounting type light emitting display device, process for making

A chip light emitting device is disclosed. A light emitting chip (LED chip) has overlying semiconductor layers to have a light emitting layer defined between the semiconductor layers. End electrodes are oppositely formed on surfaces of the semiconductor layers in a manner sandwiching the light emitting layer. A substrate has a main surface mounted with the light emitting chip. Terminal electrodes are formed at respective end portions of the substrate. The terminal electrodes is respectively in electrical connection with the end electrodes. The light emitting chip is in a rectangular parallelepiped form so that the light emitting layer thereof assumes in contour a rectangle shape having longer and shorter sides. The light emitting chip is fixed on the substrate in a position that the longer side of the light emitting layer is placed in parallel to the main surface of the substrate. The chip light emitting device obtained is satisfactorily thin in thickness due to the height with respect to the main surface of the substrate is held low without reducing the area of the light emitting layer.

Growing community of inventors

Kyoto, Japan

Hiroki Ishinaga